10AX022E4F29E3SG

IC FPGA 288 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 288 13752320 220000 780-BBGA, FCBGA

Quantity 1,255 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA, FC (29x29)GradeExtendedOperating Temperature0°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O288Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80330Number of Logic Elements/Cells220000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits13752320

Overview of 10AX022E4F29E3SG – Arria 10 GX FPGA, 780-BBGA FCBGA

The 10AX022E4F29E3SG is an Intel Arria 10 GX field-programmable gate array (FPGA) device in a 780-ball FCBGA package. It is part of the Arria 10 device family of 20 nm mid-range FPGAs and SoCs engineered for higher performance and improved power efficiency compared with previous generations.

Built for midrange applications across wireless, wireline, broadcast, computing, imaging and defence markets, this device combines large logic capacity and embedded memory with wide I/O and package-level integration to address compute- and interface-intensive designs.

Key Features

  • Core logic capacity — 220,000 logic elements (cells) providing substantial programmable logic resources for control, signal processing and custom hardware acceleration.
  • Embedded memory — 13,752,320 total RAM bits for on-chip data buffering, frame storage and intermediate processing.
  • I/O and package — 288 I/O pins in a 780-BBGA (FCBGA) 29×29 package, surface-mount mounting for dense board integration.
  • Voltage supply — Core operating voltage range from 870 mV to 980 mV to match system power rails.
  • Operating conditions and grade — Extended grade device with an operating temperature range of 0 °C to 100 °C for demanding operational environments.
  • Transceivers and IP architecture — Arria 10 family-level features include low-power serial transceivers, hard IP blocks such as PCIe (Gen1/Gen2/Gen3), variable-precision DSP blocks, PLLs and clock networks as documented in the device overview.
  • System integration — Family technology includes options for SoC integration, dynamic and partial reconfiguration, and a range of embedded memory and DSP resources to enable mixed compute and I/O subsystems.
  • Environmental compliance — RoHS compliant.

Typical Applications

  • Wireless infrastructure — Channel and switch cards, remote radio head modules and mobile backhaul systems benefitting from programmable logic and transceiver support.
  • Wireline and transport — 40G/100G muxponders, transponders and line cards where high-speed serial interfaces and programmable datapaths are required.
  • Broadcast and professional AV — Studio switches, transport and video processing applications that require large on-chip memory and flexible I/O arrangements.
  • Compute and storage acceleration — Flash cache, cloud computing servers and server acceleration functions leveraging the device’s logic density and embedded memory.
  • Imaging and medical systems — Diagnostic imaging and scanner front-end processing using DSP blocks and on-chip RAM for real-time data handling.

Unique Advantages

  • High logic density: 220,000 logic elements enable complex custom logic, parallel processing and hardware offload within a single FPGA device.
  • Significant on-chip memory: 13.75 Mbit of embedded RAM reduces reliance on external memory for buffering and frame storage, simplifying system design.
  • Flexible I/O in a compact package: 288 I/Os in a 780-ball FCBGA (29×29) package provides broad connectivity while supporting compact board layouts.
  • Power-optimized family architecture: Arria 10 device documentation highlights power-efficiency features and power-saving technologies suitable for power-sensitive designs.
  • System-level IP and integration: Family-level support for hard IP (PCIe Gen1/2/3), clock networks, PLLs, DSP blocks and transceivers facilitates integration of complex subsystems.
  • Extended operating range: Extended-grade qualification with 0 °C to 100 °C operating temperature supports deployment in a range of controlled-environment and industrial-adjacent applications.

Why Choose 10AX022E4F29E3SG?

The 10AX022E4F29E3SG positions itself as a midrange Arria 10 GX FPGA option that balances large programmable logic capacity, substantial on-chip memory and broad I/O in a compact 780-BBGA package. Its family-level features—low-power transceivers, DSP blocks, hard IP and reconfiguration capabilities—make it suitable for designs that require a mix of compute, high-speed interfaces and system integration.

For teams developing wireless, wireline, broadcast, compute acceleration or imaging systems, this device offers a combination of performance-oriented architecture and power-aware design elements, backed by the Arria 10 device documentation and ecosystem support.

Request a quote or submit an inquiry to check availability, pricing and lead times for the 10AX022E4F29E3SG.

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