10AX022E4F29I3LG

The 10AX022E4F29I3LG is an Intel Arria 10 GX field-programmable gate array (FPGA) device built on the Arria 10 family architecture. It combines high logic density and embedded memory with a 780-ball FCBGA package for surface-mount applications.

Designed for midrange, performance-sensitive applications across wireless, wireline, broadcast, computing, medical and defense markets, this device emphasizes performance and power-efficiency characteristics described for the Arria 10 family.

Key Features

• Core Logic — 220,000 logic elements provide a large fabric for implementing complex midrange FPGA designs and custom accelerators.
• Embedded Memory — 13,752,320 total RAM bits of on-chip memory to support buffering, packet processing, and local data storage requirements.
• I/O Capacity — 288 general-purpose I/O pins suitable for a wide range of peripheral, memory and interface connections.
• Power Supply — Operates from 870 mV to 980 mV supply rails, enabling designs that target Arria 10 power domains and rail constraints.
• Package & Mounting — 780-BBGA FCBGA package (supplier package: 780-FBGA, FC 29×29) with surface-mount mounting for compact board-level integration.
• Operating Range — Industrial-grade operation from −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• Arria 10 Family Capabilities — Part of the Intel Arria 10 device family, which emphasizes higher performance and power efficiency at 20 nm and includes features for memory interfaces, PLLs, transceivers and SoC integration (as documented in the device overview).

Typical Applications

• Wireless Infrastructure — Implements channel and switch card logic for remote radio heads and mobile backhaul leveraging high logic density and power-efficient operation.
• Wireline Networking — Supports line cards and muxponders for 40G/100G and high-speed aggregation where embedded memory and abundant I/O are required.
• Broadcast & Media — Suitable for studio switches, video routing and professional audio/video processing that require dense logic and on-chip buffering.
• Compute Acceleration & Storage — Enables server acceleration tasks and flash-cache controllers using the device’s logic capacity and embedded memory.
• Medical & Military Systems — Applicable to diagnostic imaging, radar and control systems that demand industrial temperature range and substantial logic resources.

Unique Advantages

• High logic density: 220,000 logic elements accommodate complex algorithms and multi-function designs without immediate need for multi-chip partitioning.
• Significant on-chip memory: 13.75 Mbit of embedded RAM reduces external memory dependency for many buffering and staging use cases.
• Robust I/O count: 288 I/Os provide flexible interfacing to peripherals, memory devices and high-speed links.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployments in temperature-demanding installations.
• Compact BGA packaging: 780-ball FCBGA (29×29) surface-mount package balances board area and thermal/mechanical integration.
• Power-aware operation: Narrow supply range (870–980 mV) aligns with Arria 10 power domains for controlled power budgeting.

Why Choose 10AX022E4F29I3LG?

The 10AX022E4F29I3LG positions itself as a midrange, high-density Arria 10 GX FPGA option that combines substantial logic resources and embedded memory with a hardened package and industrial temperature rating. It is suitable for designers targeting power-efficient, logic- and memory-intensive applications across communications, broadcast, compute acceleration, medical and defense markets.

As part of the Intel Arria 10 device family, this device is supported by the Arria 10 documentation and development resources referenced in the device overview, enabling engineers to leverage documented features for configuration, memory interfaces, clocking and power management.

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