10AX027E1F27I1HG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 17870848 270000 672-BBGA, FCBGA

Quantity 320 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs101620Number of Logic Elements/Cells270000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits17870848

Overview of 10AX027E1F27I1HG – Arria 10 GX FPGA, 270000 logic elements

The 10AX027E1F27I1HG is an Intel Arria 10 GX field-programmable gate array (FPGA) device targeted at mid-range, high-performance applications. It is part of the Arria 10 family of 20 nm devices that combine logic, embedded memory, DSP blocks and high-speed transceiver capabilities in a power-conscious architecture.

Designed for industrial use, this device offers 270,000 logic elements, 17,870,848 bits of on-chip RAM and 240 I/O pins in a 672-ball FCBGA package, making it suitable for wireless, wireline, broadcast, computing, medical and defense applications that require substantial programmable logic and integrated system features.

Key Features

  • Logic Capacity — 270,000 logic elements for complex custom logic, control and acceleration functions.
  • Embedded Memory — 17,870,848 total RAM bits to support large on-chip buffers, packet processing and state storage.
  • I/O and Package — 240 general-purpose I/O pins; supplied in a 672-ball FCBGA (27×27) surface-mount package for dense board integration.
  • Transceivers and High-Speed Interfaces — Arria 10 GX devices include low-power serial transceivers and hard IP for high-speed interfaces referenced in the device family overview, supporting modern link standards and multi‑Gbps connectivity.
  • Hard IP for Protocols — Family documentation references integrated hard IP such as PCIe Gen1/Gen2/Gen3 and enhanced PCS hard IP for 10 Gbps Ethernet and Interlaken, enabling offload of common protocol functions.
  • DSP and Clocking Resources — Variable-precision DSP blocks and flexible PLL/clock networks are included at the device-family level to support signal processing and timing architectures.
  • Power and Voltage — Operates from a core voltage range of 870 mV to 980 mV, reflecting the device-family power-optimized 20 nm implementation.
  • Operating Range and Grade — Industrial-grade device with an operating temperature range of −40 °C to 100 °C for use in temperature-challenging environments.
  • Standards and Compliance — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards, remote radio head functions and mobile backhaul designs that require programmable logic and high-speed serial links.
  • Wireline Optical and Networking — 40G/100G muxponders, transponders and line cards where integrated hard IP and high-bandwidth memory are used for packet processing and protocol offload.
  • Broadcast and Media — Studio switches, video processing and professional audio/video transport that benefit from on-chip DSP resources and deterministic I/O.
  • Compute and Storage Acceleration — Server and storage acceleration tasks such as flash caching and NVMe/packet processing using a combination of logic density and embedded RAM.
  • Medical and Defense Systems — Imaging, radar and secure communications leveraging robust operating range and programmable hardware for algorithm acceleration.

Unique Advantages

  • High Logic Density: 270,000 logic elements enable complex custom architectures and hardware acceleration without external logic expansion.
  • Substantial On‑Chip Memory: Nearly 18 Mbits of embedded RAM reduces external memory dependence for buffering and stateful processing.
  • Integrated High‑Speed Interfaces: Family-level hard IP for PCIe and Ethernet simplifies implementation of common high-bandwidth protocols and reduces design time.
  • Industrial Temperature Rating: −40 °C to 100 °C operating range supports deployments in temperature-demanding environments.
  • Compact, Surface‑Mount Packaging: 672-ball FCBGA (27×27) package provides a high pin count and compact footprint for space-constrained boards.
  • Power‑Optimized 20 nm Architecture: The Arria 10 device family emphasizes power efficiency through device-level power-saving technologies and a low core voltage range.

Why Choose 10AX027E1F27I1HG?

The 10AX027E1F27I1HG Arria 10 GX FPGA is positioned for mid-range designs that need a balance of programmable logic capacity, on-chip memory and integrated interface IP in an industrial-grade package. Its combination of 270,000 logic elements, large embedded RAM and family-level support for high-speed transceivers and protocol hard IP makes it suitable for systems that require on-board acceleration, protocol handling and deterministic I/O.

For teams building wireless infrastructure, network line cards, media processing systems or compute/storage accelerators, this device delivers the configurability and integration expected from the Arria 10 family, while providing the environmental range and package density required for industrial deployments.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the 10AX027E1F27I1HG Arria 10 GX FPGA. Our team can provide lead-time details and ordering support for your project needs.

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