10AX027E1F29E1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 17870848 270000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,899 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 101620 | Number of Logic Elements/Cells | 270000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17870848 |
Overview of 10AX027E1F29E1SG – Arria 10 GX FPGA, 780-BBGA FCBGA
The 10AX027E1F29E1SG is an Intel® Arria® 10 GX field-programmable gate array (FPGA) in a 780-BBGA FCBGA package designed for mid-range, high-performance and power-sensitive applications. It leverages the Arria 10 device family architecture to provide a balance of programmable logic, embedded memory, and I/O capability for markets such as wireless, wireline, broadcast, computing, medical, and defense.
This device combines 270,000 logic elements with embedded RAM and broad I/O capacity to support packet-processing, high-speed interface logic, and compute-acceleration tasks while operating within a narrow core supply range for optimized power delivery.
Key Features
- Core Logic 270,000 logic elements for implementing complex custom logic and control functions.
- Embedded Memory 17,870,848 total RAM bits to support on-chip buffering, caching, and intermediate data storage.
- I/O Capacity 360 user I/O pins to interface with external memory, high-speed PHYs, and peripheral devices.
- Package & Mounting 780-BBGA (FCBGA) package, supplier device package 780-FBGA (29×29), surface-mount mounting for compact board integration.
- Power Core voltage supply range from 870 mV to 980 mV to match regulated power domains and enable consistent operation across permitted voltages.
- Operating Range Extended-grade operating temperature from 0 °C to 100 °C for applications requiring elevated ambient tolerance.
- Environmental Compliance RoHS compliant to meet common regulatory requirements for lead-free assembly.
- Arria 10 Family Capabilities Based on the Arria 10 device family architecture (20 nm), which emphasizes performance and power-efficiency for mid-range FPGA applications.
Typical Applications
- Wireless Infrastructure — Channel and switch cards, remote radio head functions, and mobile backhaul logic where programmable hardware accelerates signal processing.
- Wireline Networking — Line cards, muxponders, and aggregation equipment that require programmable logic for packet processing and protocol adaptation.
- Broadcast and Professional Video — Studio switches and transport functions that benefit from on-chip buffering and flexible I/O mapping.
- Computing & Storage — Server acceleration, flash cache control, and custom offload engines that use FPGA logic and embedded RAM for low-latency tasks.
- Medical & Defense Systems — Diagnostic imaging, radar, and guidance control implementations that require configurable logic and moderate temperature-range operation.
Unique Advantages
- Large Logic Capacity: 270,000 logic elements enable implementation of complex algorithms and multiple concurrent hardware functions without external ASICs.
- Substantial On-Chip Memory: 17,870,848 RAM bits reduce dependency on external memory for intermediate buffering and pipeline stages.
- Versatile I/O Count: 360 I/O pins support diverse peripheral and memory interfaces, simplifying board-level routing and integration.
- Compact, Serviceable Packaging: 780-BBGA FCBGA footprint (29×29) offers a dense package option for space-constrained designs while supporting surface-mount assembly.
- Controlled Power Domain: Narrow core voltage range (870 mV–980 mV) helps designers standardize power delivery for predictable performance.
- Regulatory Readiness: RoHS compliance eases adoption in lead-free manufacturing processes.
Why Choose 10AX027E1F29E1SG?
The 10AX027E1F29E1SG positions itself as a versatile Arria 10 GX FPGA option for designs that need substantial logic, on-chip memory, and flexible I/O in a compact surface-mount package. Its extended-grade operating temperature and RoHS compliance make it suitable for many commercial and defense-oriented electronics where dependable operation and regulatory adherence are required.
Engineers and procurement teams seeking a mid-range FPGA with proven Arria 10 family characteristics—balancing performance and power efficiency while supporting a wide set of application domains—will find this device offers the core resources and package options to accelerate development and integration.
Request a quote or submit a sales inquiry to receive pricing and availability for the 10AX027E1F29E1SG. Our team can assist with lead times and ordering details to support your design schedule.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018