10AX027E2F27E1HG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 17870848 270000 672-BBGA, FCBGA

Quantity 637 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeExtendedOperating Temperature0°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs101620Number of Logic Elements/Cells270000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits17870848

Overview of 10AX027E2F27E1HG – Arria 10 GX FPGA, 672‑FBGA (27×27), Extended Grade

The 10AX027E2F27E1HG is an Intel Arria 10 GX field-programmable gate array (FPGA) device in a 672‑FBGA (27×27) surface-mount package. It is part of the Arria 10 family of 20‑nm mid-range FPGAs and SoCs, designed for high-performance, power‑efficient implementations.

Targeted at mid-range, performance‑sensitive applications across wireless, wireline, broadcast, computing and medical markets, this Arria 10 GX variant delivers a balance of logic density, embedded memory, and high‑speed I/O suitable for complex system designs.

Key Features

  • Core Logic — 270,000 logic elements (cells) to implement complex digital functions and custom accelerators.
  • Embedded Memory — 17,870,848 total RAM bits for on‑chip buffering, packet processing, and intermediate data storage.
  • I/O and Interface Support — 240 user I/O pins; Arria 10 device family features hard IP for PCIe Gen1/Gen2/Gen3 and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet as part of the series capability set.
  • High‑Speed Serial Transceivers — Series documentation highlights low‑power serial transceivers suitable for high‑bandwidth links and retimer/PHY integration.
  • Power — Operates with core supply in the 870 mV to 980 mV range to support power‑efficient designs.
  • Configuration and Reconfiguration — Series supports dynamic and partial reconfiguration options to update logic without full device reprogramming.
  • Package & Mounting — 672‑BBGA / 672‑FBGA (27×27) surface‑mount package for compact board-level integration.
  • Temperature & Grade — Extended grade with operating temperature range of 0 °C to 100 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Wireless infrastructure — Implements channel and switch cards, remote radio head logic, and mobile backhaul processing requiring balanced performance and power efficiency.
  • Wireline networking — Supports 40G/100G muxponders, transponders, and line card functions where high‑speed I/O and protocol hard IP are beneficial.
  • Broadcast and professional video — Enables studio switches, transport, and video processing tasks that demand on‑chip memory and flexible logic resources.
  • Computing and storage acceleration — Suitable for flash cache, server acceleration, and cloud compute offload functions requiring dense logic and embedded RAM.
  • Medical and imaging — Supports diagnostic imaging and scanner processing pipelines benefiting from high logic density and reconfigurable hardware.

Unique Advantages

  • High logic density: 270,000 logic elements provide the capacity to implement complex data paths, control logic, and custom accelerators on a single device.
  • Significant on‑chip memory: Nearly 18 Mbits of embedded RAM reduces external memory dependency for buffering and real‑time data processing.
  • Integrated high‑speed I/O ecosystem: Series support for PCIe Gen1/2/3 hard IP and 10 Gbps Ethernet PCS accelerates system integration of common high‑bandwidth interfaces.
  • Flexible reconfiguration: Dynamic and partial reconfiguration capabilities allow targeted updates to functionality without full device reprogramming, improving maintainability and uptime.
  • Compact, production‑friendly package: 672‑FBGA (27×27) surface‑mount package simplifies board layout for space‑constrained applications.
  • Extended operating grade: 0 °C to 100 °C rating and RoHS compliance support a wide range of commercial and industrial deployment scenarios.

Why Choose 10AX027E2F27E1HG?

The 10AX027E2F27E1HG Arria 10 GX FPGA balances significant logic capacity and embedded memory with a compact 672‑FBGA package and extended‑grade operation. It is well suited for mid‑range designs that require performance, power efficiency, and a flexible I/O and protocol feature set.

As part of the Arria 10 family, this device benefits from the series' documented capabilities for high‑speed transceivers, protocol hard IP, and reconfiguration features—making it a practical choice for developers building scalable, long‑lived platforms across networking, broadcast, compute acceleration, and imaging markets.

Request a quote or submit a pricing and availability inquiry for part number 10AX027E2F27E1HG to move your design forward.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up