10AX027E2F27E1HG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 17870848 270000 672-BBGA, FCBGA |
|---|---|
| Quantity | 637 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 101620 | Number of Logic Elements/Cells | 270000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17870848 |
Overview of 10AX027E2F27E1HG – Arria 10 GX FPGA, 672‑FBGA (27×27), Extended Grade
The 10AX027E2F27E1HG is an Intel Arria 10 GX field-programmable gate array (FPGA) device in a 672‑FBGA (27×27) surface-mount package. It is part of the Arria 10 family of 20‑nm mid-range FPGAs and SoCs, designed for high-performance, power‑efficient implementations.
Targeted at mid-range, performance‑sensitive applications across wireless, wireline, broadcast, computing and medical markets, this Arria 10 GX variant delivers a balance of logic density, embedded memory, and high‑speed I/O suitable for complex system designs.
Key Features
- Core Logic — 270,000 logic elements (cells) to implement complex digital functions and custom accelerators.
- Embedded Memory — 17,870,848 total RAM bits for on‑chip buffering, packet processing, and intermediate data storage.
- I/O and Interface Support — 240 user I/O pins; Arria 10 device family features hard IP for PCIe Gen1/Gen2/Gen3 and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet as part of the series capability set.
- High‑Speed Serial Transceivers — Series documentation highlights low‑power serial transceivers suitable for high‑bandwidth links and retimer/PHY integration.
- Power — Operates with core supply in the 870 mV to 980 mV range to support power‑efficient designs.
- Configuration and Reconfiguration — Series supports dynamic and partial reconfiguration options to update logic without full device reprogramming.
- Package & Mounting — 672‑BBGA / 672‑FBGA (27×27) surface‑mount package for compact board-level integration.
- Temperature & Grade — Extended grade with operating temperature range of 0 °C to 100 °C.
- Compliance — RoHS compliant.
Typical Applications
- Wireless infrastructure — Implements channel and switch cards, remote radio head logic, and mobile backhaul processing requiring balanced performance and power efficiency.
- Wireline networking — Supports 40G/100G muxponders, transponders, and line card functions where high‑speed I/O and protocol hard IP are beneficial.
- Broadcast and professional video — Enables studio switches, transport, and video processing tasks that demand on‑chip memory and flexible logic resources.
- Computing and storage acceleration — Suitable for flash cache, server acceleration, and cloud compute offload functions requiring dense logic and embedded RAM.
- Medical and imaging — Supports diagnostic imaging and scanner processing pipelines benefiting from high logic density and reconfigurable hardware.
Unique Advantages
- High logic density: 270,000 logic elements provide the capacity to implement complex data paths, control logic, and custom accelerators on a single device.
- Significant on‑chip memory: Nearly 18 Mbits of embedded RAM reduces external memory dependency for buffering and real‑time data processing.
- Integrated high‑speed I/O ecosystem: Series support for PCIe Gen1/2/3 hard IP and 10 Gbps Ethernet PCS accelerates system integration of common high‑bandwidth interfaces.
- Flexible reconfiguration: Dynamic and partial reconfiguration capabilities allow targeted updates to functionality without full device reprogramming, improving maintainability and uptime.
- Compact, production‑friendly package: 672‑FBGA (27×27) surface‑mount package simplifies board layout for space‑constrained applications.
- Extended operating grade: 0 °C to 100 °C rating and RoHS compliance support a wide range of commercial and industrial deployment scenarios.
Why Choose 10AX027E2F27E1HG?
The 10AX027E2F27E1HG Arria 10 GX FPGA balances significant logic capacity and embedded memory with a compact 672‑FBGA package and extended‑grade operation. It is well suited for mid‑range designs that require performance, power efficiency, and a flexible I/O and protocol feature set.
As part of the Arria 10 family, this device benefits from the series' documented capabilities for high‑speed transceivers, protocol hard IP, and reconfiguration features—making it a practical choice for developers building scalable, long‑lived platforms across networking, broadcast, compute acceleration, and imaging markets.
Request a quote or submit a pricing and availability inquiry for part number 10AX027E2F27E1HG to move your design forward.

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