10AX027E2F27E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 17870848 270000 672-BBGA, FCBGA |
|---|---|
| Quantity | 152 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA, FC (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 101620 | Number of Logic Elements/Cells | 270000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17870848 |
Overview of 10AX027E2F27E2LG – Arria 10 GX FPGA, 672-BBGA (FCBGA)
The 10AX027E2F27E2LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 672-ball BGA (FCBGA) package for surface-mount applications. It is part of the Arria 10 device family of 20 nm mid-range FPGAs and SoCs, which are described as delivering higher performance and power efficiency for midrange, power-sensitive designs.
This device targets communication, broadcast, compute and imaging markets where programmable logic density, embedded RAM capacity and a high I/O count enable complex, flexible system designs.
Key Features
- Logic Capacity — 270,000 logic elements to implement complex custom logic, control and acceleration functions.
- Embedded Memory — 17,870,848 total RAM bits to support large on-chip buffers, packet queues or algorithm state.
- I/O Count — 240 general-purpose I/O pins for wide connectivity to peripherals, memory interfaces and board-level buses.
- Package & Mounting — 672-BBGA (FCBGA) supply package; supplier device package listed as 672-FBGA, FC (27×27); surface-mount mounting type for compact board integration.
- Power Supply — Core voltage supply range from 870 mV to 980 mV to match system power rails and regulator choices.
- Temperature & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for use in a variety of commercial and industrial-adjacent environments.
- Regulatory — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel and switch card processing in radio head and backhaul equipment using programmable logic and on-chip memory for signal handling and control.
- Wireline Communications — Line cards and media converters where large on-chip RAM and high I/O counts support packet buffering and interface bridging.
- Broadcast & Professional AV — Video and audio routing, switching and processing functions leveraging the device’s logic density and memory for frame buffering and stream handling.
- Compute & Storage Acceleration — Server acceleration and flash-cache controllers that use programmable logic and embedded RAM to implement custom data-paths and fast buffers.
- Medical Imaging — Diagnostic imaging systems that require programmable dataflow and on-chip memory for intermediate image storage and processing pipelines.
Unique Advantages
- High Logic Density: 270,000 logic elements enable extensive custom logic and datapath implementation without external ASICs.
- Substantial On-Chip Memory: Nearly 18 million bits of embedded RAM support large buffers and stateful algorithms directly on the FPGA fabric.
- Broad Connectivity: 240 I/O pins provide flexible board-level interfacing options for diverse system designs.
- Compact, Surface-Mount Package: 672-ball FCBGA packaging allows high-density placement and straightforward PCB mounting for space-constrained products.
- Designed for Power-Sensitive Designs: Listed as part of a device family focused on power efficiency, with a defined core voltage range to match system power design.
- Extended Temperature Grade and RoHS Compliance: Extended operating range and environmental compliance suit a wide range of commercial and industrial applications.
Why Choose 10AX027E2F27E2LG?
The 10AX027E2F27E2LG combines substantial programmable logic capacity, large embedded RAM and a high I/O count in a compact 672-BBGA surface-mount package. As a member of the Intel Arria 10 family of 20 nm mid-range FPGAs and SoCs, it is positioned for designs that need a balance of performance and power efficiency for midrange applications across communications, broadcast, compute and imaging markets.
Design teams seeking scalable, document-supported FPGA solutions will find this device suited to projects requiring on-chip memory for buffering, extensive logic for custom accelerators or controllers, and flexible I/O for system integration. The extended grade and RoHS compliance support deployment across a variety of commercial and industrial use cases.
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