10AX027E2F27E2LG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 17870848 270000 672-BBGA, FCBGA

Quantity 152 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA, FC (27x27)GradeExtendedOperating Temperature0°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs101620Number of Logic Elements/Cells270000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits17870848

Overview of 10AX027E2F27E2LG – Arria 10 GX FPGA, 672-BBGA (FCBGA)

The 10AX027E2F27E2LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 672-ball BGA (FCBGA) package for surface-mount applications. It is part of the Arria 10 device family of 20 nm mid-range FPGAs and SoCs, which are described as delivering higher performance and power efficiency for midrange, power-sensitive designs.

This device targets communication, broadcast, compute and imaging markets where programmable logic density, embedded RAM capacity and a high I/O count enable complex, flexible system designs.

Key Features

  • Logic Capacity — 270,000 logic elements to implement complex custom logic, control and acceleration functions.
  • Embedded Memory — 17,870,848 total RAM bits to support large on-chip buffers, packet queues or algorithm state.
  • I/O Count — 240 general-purpose I/O pins for wide connectivity to peripherals, memory interfaces and board-level buses.
  • Package & Mounting — 672-BBGA (FCBGA) supply package; supplier device package listed as 672-FBGA, FC (27×27); surface-mount mounting type for compact board integration.
  • Power Supply — Core voltage supply range from 870 mV to 980 mV to match system power rails and regulator choices.
  • Temperature & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for use in a variety of commercial and industrial-adjacent environments.
  • Regulatory — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Channel and switch card processing in radio head and backhaul equipment using programmable logic and on-chip memory for signal handling and control.
  • Wireline Communications — Line cards and media converters where large on-chip RAM and high I/O counts support packet buffering and interface bridging.
  • Broadcast & Professional AV — Video and audio routing, switching and processing functions leveraging the device’s logic density and memory for frame buffering and stream handling.
  • Compute & Storage Acceleration — Server acceleration and flash-cache controllers that use programmable logic and embedded RAM to implement custom data-paths and fast buffers.
  • Medical Imaging — Diagnostic imaging systems that require programmable dataflow and on-chip memory for intermediate image storage and processing pipelines.

Unique Advantages

  • High Logic Density: 270,000 logic elements enable extensive custom logic and datapath implementation without external ASICs.
  • Substantial On-Chip Memory: Nearly 18 million bits of embedded RAM support large buffers and stateful algorithms directly on the FPGA fabric.
  • Broad Connectivity: 240 I/O pins provide flexible board-level interfacing options for diverse system designs.
  • Compact, Surface-Mount Package: 672-ball FCBGA packaging allows high-density placement and straightforward PCB mounting for space-constrained products.
  • Designed for Power-Sensitive Designs: Listed as part of a device family focused on power efficiency, with a defined core voltage range to match system power design.
  • Extended Temperature Grade and RoHS Compliance: Extended operating range and environmental compliance suit a wide range of commercial and industrial applications.

Why Choose 10AX027E2F27E2LG?

The 10AX027E2F27E2LG combines substantial programmable logic capacity, large embedded RAM and a high I/O count in a compact 672-BBGA surface-mount package. As a member of the Intel Arria 10 family of 20 nm mid-range FPGAs and SoCs, it is positioned for designs that need a balance of performance and power efficiency for midrange applications across communications, broadcast, compute and imaging markets.

Design teams seeking scalable, document-supported FPGA solutions will find this device suited to projects requiring on-chip memory for buffering, extensive logic for custom accelerators or controllers, and flexible I/O for system integration. The extended grade and RoHS compliance support deployment across a variety of commercial and industrial use cases.

Request a quote or submit an inquiry to begin specifying 10AX027E2F27E2LG for your next design.

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