10AX027E2F27I1HG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 17870848 270000 672-BBGA, FCBGA |
|---|---|
| Quantity | 1,833 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 101620 | Number of Logic Elements/Cells | 270000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17870848 |
Overview of 10AX027E2F27I1HG – Arria 10 GX FPGA, 270,000 logic elements, 240 I/O, 672-FBGA
The 10AX027E2F27I1HG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 672‑FBGA (27×27) package. It combines a large logic fabric, abundant embedded RAM, and high-density I/O to address midrange, performance-sensitive applications across wireless, wireline, broadcast, computing, medical, and defense markets.
Designed for power-conscious midrange designs, this device delivers a balance of performance and efficiency in a surface-mount, industrial‑grade package with core voltage support from 870 mV to 980 mV and an operating temperature range of −40 °C to 100 °C.
Key Features
- Logic Capacity — 270,000 logic elements (cells) for implementing complex programmable logic and system functions.
- Embedded Memory — 17,870,848 total RAM bits of on‑chip memory to support large buffering, caches, and state machines.
- I/O Density — 240 user I/O pins to connect high-speed interfaces, external memory, and peripherals.
- Package & Mounting — 672‑FBGA (27×27) FCBGA package, surface‑mount housing for compact board integration.
- Power and Temperature — Core voltage range 870 mV to 980 mV; industrial operating temperature −40 °C to 100 °C for deployment in demanding environments.
- Platform Capabilities (Arria 10 family) — Architecture-level features such as variable‑precision DSP blocks, embedded memory blocks, clock networks with PLLs, low‑power serial transceivers, and hard IP for protocols like PCIe and 10 Gbps Ethernet are documented for Arria 10 devices.
- Compliance — RoHS compliant for regulatory environmental requirements.
Typical Applications
- Wireless Infrastructure — Platform logic for channel and switch cards in remote radio heads and mobile backhaul equipment where midrange performance and power efficiency are required.
- Wireline Networking — Line cards, muxponders, and transponders (including 40G/100G applications) that need programmable logic, embedded memory, and high‑speed serial connectivity.
- Broadcast and Professional AV — Studio switches, videoconferencing, and professional audio/video processing that leverage programmable fabric and on‑chip RAM for real‑time processing.
- Computing & Storage Acceleration — Server acceleration and flash‑cache offload functions where FPGA logic and local memory accelerate application workloads.
- Defense & Medical Systems — Radar, electronic warfare, diagnostic imaging, and other mission‑critical systems benefiting from industrial temperature range and programmable hardware flexibility.
Unique Advantages
- High Logic Density: 270,000 logic elements enable complex system integration on a single device, reducing board-level component count.
- Large On‑Chip Memory: Nearly 18 Mb of embedded RAM supports wide buffering and data‑intensive pipelines without external memory for many functions.
- Rich I/O and Packaging: 240 I/O in a 672‑FBGA package gives flexible connectivity and a compact footprint for high‑density designs.
- Industrial‑Grade Operation: Rated for −40 °C to 100 °C operation and surface‑mount assembly, supporting deployment in harsh or thermally demanding environments.
- Power‑Aware Design: Core voltage range and Arria 10 family power‑efficiency features align the device to power‑sensitive midrange applications.
- Standards and Protocol IP: Arria 10 device family documentation includes hard IP and transceiver features for common high‑speed protocols, simplifying integration of Ethernet and PCIe interfaces.
Why Choose 10AX027E2F27I1HG?
The 10AX027E2F27I1HG positions itself as a midrange, performance‑oriented FPGA that balances dense programmable logic, substantial embedded memory, and significant I/O capability in a single industrial‑grade package. It is suited for designers who need a programmable platform capable of handling networking, signal processing, and acceleration tasks while maintaining a compact board footprint.
With Arria 10 family architecture features documented across device handbooks and device overviews, this part offers design scalability and the documented platform capabilities engineers rely on when developing power‑sensitive, midrange systems that require both performance and flexibility.
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