10AX027E1F29I1HG

The 10AX027E1F29I1HG is an Intel Arria 10 GX FPGA in a 780‑FBGA (29×29) surface‑mount package. It is part of the Arria 10 family of 20‑nm mid‑range FPGAs and SoCs designed for high‑performance, power‑sensitive applications.

With 270,000 logic elements, 17,870,848 bits of embedded RAM and 360 I/Os, this device targets wireless, wireline, broadcast, computing and industrial applications that require substantial logic density, embedded memory and flexible I/O in an industrial temperature‑range package.

Key Features

• Core Logic — 270,000 logic elements provide large programmable logic capacity for complex FPGA designs and algorithm implementation.
• Logic Array Blocks — 101,620 logic array resources reported for mapping and partitioning of designs.
• Embedded Memory — 17,870,848 total RAM bits for on‑chip buffering, line rate processing, and intermediate storage.
• I/O Density — 360 user I/Os support broad external interface requirements and flexible board integration.
• Transceiver and Interface Support (family) — Arria 10 device family documentation lists low‑power serial transceivers, enhanced PCS, and hard IP for protocols such as PCIe Gen1/Gen2/Gen3 and 10 Gbps Ethernet.
• Clocking and PLLs (family) — Advanced clock networks with fractional synthesis and multiple PLL sources are provided at the device family level for timing and synchronization.
• Power Supply — Core voltage supply range from 870 mV to 980 mV to match targeted power rails and design constraints.
• Package & Mounting — 780‑BBGA / FCBGA package (supplier package: 780‑FBGA 29×29) in a surface‑mount form factor for high‑density board designs.
• Industrial Temperature — Operating range from −40 °C to 100 °C for use in temperature‑sensitive industrial environments.
• Compliance — RoHS compliant material and manufacturing status.

Typical Applications

• Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul where programmable logic and transceiver support enable complex signal processing.
• Wireline Communications — 40G/100G muxponders, transponders and line cards that require high logic density, embedded memory and protocol hard IP.
• Broadcast & Professional AV — Studio switches, transport and videoconferencing equipment leveraging on‑chip memory and flexible I/O for video processing and routing.
• Computing & Storage — Server acceleration, flash cache and cloud infrastructure components using the device’s logic capacity and embedded RAM for offload and caching functions.
• Industrial Systems — Control, signal processing and secure communications in industrial applications that benefit from the device’s industrial temperature rating and package density.

Unique Advantages

• High logic capacity: 270,000 logic elements enable implementation of large, complex designs without immediate migration to higher device tiers.
• Substantial on‑chip memory: Nearly 18 Mbits of embedded RAM reduces external memory dependency for many buffering and packet processing tasks.
• Broad I/O and packaging density: 360 I/Os in a 780‑FBGA (29×29) footprint supports dense board routing and high‑pin parallel interfaces.
• Industrial temperature range: −40 °C to 100 °C operation supports deployment in harsh or temperature‑variable environments.
• Platform‑level connectivity: Family features such as PCIe hard IP and serial transceivers enable integration with common high‑speed protocols (as described in the Arria 10 device documentation).
• Controlled power envelope: Core supply range of 870 mV–980 mV facilitates predictable power budgeting and thermal planning.

Why Choose 10AX027E1F29I1HG?

The 10AX027E1F29I1HG positions itself as a mid‑range Arria 10 GX FPGA that balances high logic and memory resources with industrial temperature capability and dense I/O. It is suited to designers who need significant on‑chip resources—logic, RAM and I/O—in a surface‑mount FBGA package.

For teams developing wireless, wireline, broadcast, computing or industrial systems, this device offers a blend of programmable capacity and family‑level connectivity features to accelerate time‑to‑market while supporting robust, long‑lifecycle deployments.

Request a quote or submit an inquiry to receive pricing, lead‑time and availability information for the 10AX027E1F29I1HG. Our team can provide the details needed to evaluate this FPGA for your next design.