10AX027E1F29E1HG

IC FPGA 360 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 17870848 270000 780-BBGA, FCBGA

Quantity 187 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeExtendedOperating Temperature0°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs101620Number of Logic Elements/Cells270000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits17870848

Overview of 10AX027E1F29E1HG – Arria 10 GX Field Programmable Gate Array (FPGA) IC

The 10AX027E1F29E1HG is an Intel Arria 10 GX series FPGA implemented in a 780‑ball FCBGA (29×29) package. It is a 20‑nm mid‑range, power‑efficient FPGA family device designed for high‑performance, mid‑range applications requiring significant logic capacity, embedded RAM, and flexible I/O.

Typical use cases include wireless and wireline communication systems, broadcast and professional AV equipment, and compute/storage acceleration where a combination of logic density, on‑chip RAM, and extensive I/O is required.

Key Features

  • Core Logic  270,000 logic elements (cells) for implementing complex digital logic and state machines.
  • Embedded Memory  Total on‑chip RAM capacity of 17,870,848 bits to support buffering, frame storage, and on‑chip data paths.
  • I/O and Packaging  360 I/O pins in a 780‑FBGA (29×29) surface‑mount package; extended grade and RoHS compliant packaging for standard commercial system deployment.
  • Power Supply  Supported core voltage range 870 mV to 980 mV for device operation.
  • Operating Temperature  Rated for 0 °C to 100 °C ambient operation (extended grade).
  • Architecture and Integration  20‑nm Arria 10 architecture with features described in the device overview such as variable‑precision DSP blocks, embedded memory blocks, clock networks and PLLs, and integrated hard IP for high‑speed serial protocols.
  • Compliance  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment where on‑chip logic density and embedded RAM support signal processing and buffering.
  • Wireline Communications  Muxponders, transponders and line cards for 40G/100G systems that require substantial FPGA logic, memory, and high‑speed I/O capability.
  • Broadcast and Professional AV  Studio switching and video processing applications that benefit from large on‑chip RAM and flexible I/O mapping.
  • Compute and Storage Acceleration  Flash cache, cloud compute servers, and server acceleration applications leveraging integrated DSP and large logic resources for custom acceleration tasks.

Unique Advantages

  • High Logic Capacity: 270,000 logic elements enable implementation of complex algorithms, protocol stacks, and large state machines without immediate need for external logic.
  • Significant On‑Chip RAM: 17,870,848 total RAM bits provide substantial on‑chip storage for buffering, packet queuing, and intermediate data processing.
  • Generous I/O Count: 360 I/Os in a 780‑FBGA package provide flexible external connectivity options for high‑pin‑count interfaces.
  • Mid‑Range 20‑nm Architecture: Arria 10 family design delivers higher performance and power efficiency consistent with Intel's 20‑nm mid‑range FPGA positioning.
  • Extended Operating Range: Rated 0 °C to 100 °C and supplied within a defined core voltage window (870–980 mV) for consistent operation in standard commercial and extended‑grade systems.
  • RoHS Compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose 10AX027E1F29E1HG?

The 10AX027E1F29E1HG Arria 10 GX device offers a balanced combination of high logic density, large embedded RAM, and extensive I/O in a compact 780‑FBGA package. Its 20‑nm Arria 10 architecture is targeted at engineers building mid‑range systems that require a mix of performance and power efficiency while maintaining on‑chip resources for demanding signal processing and protocol handling.

This device is suited to design teams building wireless and wireline communication equipment, broadcast systems, and compute/storage accelerators who need a reliable, high‑capacity FPGA with vendor‑documented architecture features and extended grade operating range.

Request a quote or submit a parts inquiry to check pricing and availability for the 10AX027E1F29E1HG Arria 10 GX FPGA.

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