10AX027E1F27E1SG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 17870848 270000 672-BBGA, FCBGA

Quantity 12 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeExtendedOperating Temperature0°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs101620Number of Logic Elements/Cells270000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits17870848

Overview of 10AX027E1F27E1SG – Arria 10 GX FPGA, 270,000 Logic Elements, 240 I/O, 672-FBGA

The 10AX027E1F27E1SG is an Intel Arria 10 GX field programmable gate array (FPGA) supplied in a 672-ball FCBGA (27×27) package. It delivers a high logic density and significant on-chip memory capacity for mid-range, performance‑sensitive FPGA applications.

This device is part of the Arria 10 family of 20 nm mid-range FPGAs and SoCs, offering a balance of performance and power efficiency suited to markets such as wireless, wireline, broadcast, computing, medical, and defense applications.

Key Features

  • Core Logic  270,000 logic elements provide substantial programmable fabric for complex digital designs and custom logic implementations.
  • Embedded Memory  Total on-chip RAM of 17,870,848 bits supports large buffering, packet processing, and data-path applications directly in the FPGA.
  • I/O Capacity  240 user I/O pins enable broad external connectivity for interfaces, memory buses, and peripheral integration.
  • Voltage Supply  Operates from 870 mV to 980 mV, supporting designs that target the device’s specified core voltage range.
  • Thermal and Grade  Extended‑grade device with an operating temperature range of 0 °C to 100 °C for elevated ambient applications.
  • Package & Mounting  672-BBGA (FCBGA), supplier package 672-FBGA (27×27), surface-mount package suitable for compact, high-pin-count board designs.
  • Compliance  RoHS‑compliant material status.
  • Arria 10 Series Attributes  Part of the Arria 10 family of 20 nm devices, which emphasizes higher performance and improved power efficiency relative to prior mid-range FPGA generations.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards, remote radio head modules and mobile backhaul systems that require programmable logic and significant on-chip memory.
  • Wireline Networking  40G/100G line cards, muxponders and transponders where programmable datapath logic and multiple I/O are necessary for protocol and packet processing.
  • Broadcast & Professional AV  Studio switching, video transport and processing applications leveraging on-chip RAM and flexible I/O.
  • Computing & Storage  Server acceleration, flash cache and cloud compute offload functions that benefit from high logic density and embedded memory.
  • Medical & Imaging  Diagnostic imaging and scanner control functions that require configurable logic and integrated memory resources.

Unique Advantages

  • High programmable density: 270,000 logic elements enable complex custom logic and multi-function designs without immediate need for external processors.
  • Substantial on-chip RAM: Nearly 17.9 million RAM bits provide significant local storage for buffering, FIFOs, and data-path acceleration, reducing reliance on external memory.
  • Robust I/O capability: 240 I/O pins allow flexible interfacing to high-speed transceivers, memory devices, and peripherals in a single package.
  • Compact, high-pin-count package: 672-FBGA (27×27) FCBGA package supports dense board designs while delivering the necessary signal access for complex systems.
  • Designed for power-aware designs: As part of the Arria 10 family, the device targets improved power efficiency alongside performance for power-sensitive applications.
  • Extended operating range: Extended-grade rating and 0 °C to 100 °C operating range suit applications with elevated ambient temperatures.

Why Choose 10AX027E1F27E1SG?

The 10AX027E1F27E1SG Arria 10 GX FPGA positions itself as a high-density, power-aware programmable device for mid-range applications that need significant logic, memory, and I/O in a single surface-mount FCBGA package. Its combination of 270,000 logic elements, 17,870,848 bits of embedded RAM, and 240 I/O pins makes it well suited for designers building programmable datapaths, protocol engines, and acceleration functions.

Backed by the Arria 10 device family documentation and Intel design resources, this device provides a platform that balances performance, integration and thermal considerations for engineers targeting wireless, wireline, broadcast, compute, medical and defense-related applications.

Request a quote or submit a product inquiry for the 10AX027E1F27E1SG to begin sourcing and integration planning.

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