10AX027E1F27E1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 17870848 270000 672-BBGA, FCBGA |
|---|---|
| Quantity | 12 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 101620 | Number of Logic Elements/Cells | 270000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17870848 |
Overview of 10AX027E1F27E1SG – Arria 10 GX FPGA, 270,000 Logic Elements, 240 I/O, 672-FBGA
The 10AX027E1F27E1SG is an Intel Arria 10 GX field programmable gate array (FPGA) supplied in a 672-ball FCBGA (27×27) package. It delivers a high logic density and significant on-chip memory capacity for mid-range, performance‑sensitive FPGA applications.
This device is part of the Arria 10 family of 20 nm mid-range FPGAs and SoCs, offering a balance of performance and power efficiency suited to markets such as wireless, wireline, broadcast, computing, medical, and defense applications.
Key Features
- Core Logic 270,000 logic elements provide substantial programmable fabric for complex digital designs and custom logic implementations.
- Embedded Memory Total on-chip RAM of 17,870,848 bits supports large buffering, packet processing, and data-path applications directly in the FPGA.
- I/O Capacity 240 user I/O pins enable broad external connectivity for interfaces, memory buses, and peripheral integration.
- Voltage Supply Operates from 870 mV to 980 mV, supporting designs that target the device’s specified core voltage range.
- Thermal and Grade Extended‑grade device with an operating temperature range of 0 °C to 100 °C for elevated ambient applications.
- Package & Mounting 672-BBGA (FCBGA), supplier package 672-FBGA (27×27), surface-mount package suitable for compact, high-pin-count board designs.
- Compliance RoHS‑compliant material status.
- Arria 10 Series Attributes Part of the Arria 10 family of 20 nm devices, which emphasizes higher performance and improved power efficiency relative to prior mid-range FPGA generations.
Typical Applications
- Wireless Infrastructure Channel and switch cards, remote radio head modules and mobile backhaul systems that require programmable logic and significant on-chip memory.
- Wireline Networking 40G/100G line cards, muxponders and transponders where programmable datapath logic and multiple I/O are necessary for protocol and packet processing.
- Broadcast & Professional AV Studio switching, video transport and processing applications leveraging on-chip RAM and flexible I/O.
- Computing & Storage Server acceleration, flash cache and cloud compute offload functions that benefit from high logic density and embedded memory.
- Medical & Imaging Diagnostic imaging and scanner control functions that require configurable logic and integrated memory resources.
Unique Advantages
- High programmable density: 270,000 logic elements enable complex custom logic and multi-function designs without immediate need for external processors.
- Substantial on-chip RAM: Nearly 17.9 million RAM bits provide significant local storage for buffering, FIFOs, and data-path acceleration, reducing reliance on external memory.
- Robust I/O capability: 240 I/O pins allow flexible interfacing to high-speed transceivers, memory devices, and peripherals in a single package.
- Compact, high-pin-count package: 672-FBGA (27×27) FCBGA package supports dense board designs while delivering the necessary signal access for complex systems.
- Designed for power-aware designs: As part of the Arria 10 family, the device targets improved power efficiency alongside performance for power-sensitive applications.
- Extended operating range: Extended-grade rating and 0 °C to 100 °C operating range suit applications with elevated ambient temperatures.
Why Choose 10AX027E1F27E1SG?
The 10AX027E1F27E1SG Arria 10 GX FPGA positions itself as a high-density, power-aware programmable device for mid-range applications that need significant logic, memory, and I/O in a single surface-mount FCBGA package. Its combination of 270,000 logic elements, 17,870,848 bits of embedded RAM, and 240 I/O pins makes it well suited for designers building programmable datapaths, protocol engines, and acceleration functions.
Backed by the Arria 10 device family documentation and Intel design resources, this device provides a platform that balances performance, integration and thermal considerations for engineers targeting wireless, wireline, broadcast, compute, medical and defense-related applications.
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