10AX022E4F29I3SG

IC FPGA 288 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 288 13752320 220000 780-BBGA, FCBGA

Quantity 1,433 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA, FC (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O288Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80330Number of Logic Elements/Cells220000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits13752320

Overview of 10AX022E4F29I3SG – Arria 10 GX FPGA, 780‑FBGA FCBGA (Industrial)

The 10AX022E4F29I3SG is an Intel Arria 10 GX field programmable gate array (FPGA) offered in a 780‑ball FCBGA package for surface‑mount applications. As part of the Arria 10 device family, it is a 20‑nm mid‑range FPGA/SoC class device designed for performance‑sensitive, power‑aware system designs across communications, broadcast, compute, medical, and defense markets.

This device delivers large programmable capacity and on‑chip RAM while supporting industrial temperature ranges and a low-voltage core supply, making it suitable for embedded systems that require substantial logic, memory, and I/O integration in a compact package.

Key Features

  • Logic Capacity  Provides 220,000 logic elements to implement complex digital logic and custom accelerators.
  • On‑Chip Memory  Includes 13,752,320 total RAM bits for embedded buffering, data staging, and memory‑intensive algorithms.
  • I/O and Packaging  288 general‑purpose I/O pins in a 780‑ball FCBGA (29×29) surface‑mount package for dense board integration.
  • Power Supply  Core voltage supply range of 870 mV to 980 mV to meet the device’s low‑voltage operating requirements.
  • Industrial Temperature Grade  Specified to operate from −40 °C to 100 °C for deployments in industrial environments.
  • Embedded Architecture (Arria 10 Family)  Series features include adaptive logic modules, variable‑precision DSP blocks, multiple embedded memory block types, and advanced clock networks.
  • Interface and IP Support  Arria 10 family features include PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet protocols.
  • Serial Transceivers  Includes low‑power serial transceiver technology in the Arria 10 family for high‑speed serial links (series feature).
  • RoHS Compliant  Manufactured to meet RoHS requirements.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging on‑chip logic and embedded memory for signal processing.
  • Wireline Communications  40G/100G muxponder and transponder line cards, line‑card bridging and aggregation functions using integrated I/O and protocol hard IP.
  • Broadcast and Media  Studio switches, transport, and professional audio/video processing where dense I/O and on‑chip buffering are required.
  • Compute and Storage Acceleration  Flash cache controllers, cloud computing server acceleration, and custom compute offload designs that benefit from large logic and RAM capacity.
  • Medical and Defense Systems  Diagnostic imaging and radar/mission‑critical systems that require industrial temperature operation and substantial programmable resources.

Unique Advantages

  • Substantial Logic and Memory in One Device  220,000 logic elements and over 13.7M RAM bits enable implementation of complex algorithms and high‑capacity buffering without extensive external components.
  • Compact, Board‑Ready Package  780‑ball FCBGA (29×29) surface‑mount package concentrates I/O and logic in a small footprint for space‑constrained designs.
  • Industrial‑Ready Operation  Rated from −40 °C to 100 °C and RoHS compliant for reliable long‑lifecycle deployment in industrial applications.
  • Low‑Voltage Core  Designed for a core supply between 870 mV and 980 mV, aligning with modern low‑power system rails.
  • Series Ecosystem Features  Arria 10 family architecture provides DSP capability, embedded memory types, advanced clocking, and protocol hard IP to reduce development time for high‑performance tasks.

Why Choose 10AX022E4F29I3SG?

The 10AX022E4F29I3SG Arria 10 GX FPGA balances large programmable capacity, embedded memory, and robust I/O in a single industrial‑grade, surface‑mount package. Its combination of 220,000 logic elements, 13,752,320 total RAM bits, and 288 I/Os makes it appropriate for mid‑range designs that require significant on‑chip resources while maintaining system power efficiency and industrial temperature operation.

This device is well suited for engineers developing communications, broadcast, compute acceleration, medical imaging, and defense systems who need a scalable FPGA with the Arria 10 family’s architecture and IP capabilities. Its on‑chip resources and package density support compact, high‑function designs and long‑term deployment in demanding environments.

Request a quote or submit an inquiry to receive pricing and availability information for 10AX022E4F29I3SG and to discuss how this Arria 10 GX FPGA can meet your design requirements.

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