10AX022E4F29I3SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 288 13752320 220000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,433 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 288 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80330 | Number of Logic Elements/Cells | 220000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13752320 |
Overview of 10AX022E4F29I3SG – Arria 10 GX FPGA, 780‑FBGA FCBGA (Industrial)
The 10AX022E4F29I3SG is an Intel Arria 10 GX field programmable gate array (FPGA) offered in a 780‑ball FCBGA package for surface‑mount applications. As part of the Arria 10 device family, it is a 20‑nm mid‑range FPGA/SoC class device designed for performance‑sensitive, power‑aware system designs across communications, broadcast, compute, medical, and defense markets.
This device delivers large programmable capacity and on‑chip RAM while supporting industrial temperature ranges and a low-voltage core supply, making it suitable for embedded systems that require substantial logic, memory, and I/O integration in a compact package.
Key Features
- Logic Capacity Provides 220,000 logic elements to implement complex digital logic and custom accelerators.
- On‑Chip Memory Includes 13,752,320 total RAM bits for embedded buffering, data staging, and memory‑intensive algorithms.
- I/O and Packaging 288 general‑purpose I/O pins in a 780‑ball FCBGA (29×29) surface‑mount package for dense board integration.
- Power Supply Core voltage supply range of 870 mV to 980 mV to meet the device’s low‑voltage operating requirements.
- Industrial Temperature Grade Specified to operate from −40 °C to 100 °C for deployments in industrial environments.
- Embedded Architecture (Arria 10 Family) Series features include adaptive logic modules, variable‑precision DSP blocks, multiple embedded memory block types, and advanced clock networks.
- Interface and IP Support Arria 10 family features include PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet protocols.
- Serial Transceivers Includes low‑power serial transceiver technology in the Arria 10 family for high‑speed serial links (series feature).
- RoHS Compliant Manufactured to meet RoHS requirements.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging on‑chip logic and embedded memory for signal processing.
- Wireline Communications 40G/100G muxponder and transponder line cards, line‑card bridging and aggregation functions using integrated I/O and protocol hard IP.
- Broadcast and Media Studio switches, transport, and professional audio/video processing where dense I/O and on‑chip buffering are required.
- Compute and Storage Acceleration Flash cache controllers, cloud computing server acceleration, and custom compute offload designs that benefit from large logic and RAM capacity.
- Medical and Defense Systems Diagnostic imaging and radar/mission‑critical systems that require industrial temperature operation and substantial programmable resources.
Unique Advantages
- Substantial Logic and Memory in One Device 220,000 logic elements and over 13.7M RAM bits enable implementation of complex algorithms and high‑capacity buffering without extensive external components.
- Compact, Board‑Ready Package 780‑ball FCBGA (29×29) surface‑mount package concentrates I/O and logic in a small footprint for space‑constrained designs.
- Industrial‑Ready Operation Rated from −40 °C to 100 °C and RoHS compliant for reliable long‑lifecycle deployment in industrial applications.
- Low‑Voltage Core Designed for a core supply between 870 mV and 980 mV, aligning with modern low‑power system rails.
- Series Ecosystem Features Arria 10 family architecture provides DSP capability, embedded memory types, advanced clocking, and protocol hard IP to reduce development time for high‑performance tasks.
Why Choose 10AX022E4F29I3SG?
The 10AX022E4F29I3SG Arria 10 GX FPGA balances large programmable capacity, embedded memory, and robust I/O in a single industrial‑grade, surface‑mount package. Its combination of 220,000 logic elements, 13,752,320 total RAM bits, and 288 I/Os makes it appropriate for mid‑range designs that require significant on‑chip resources while maintaining system power efficiency and industrial temperature operation.
This device is well suited for engineers developing communications, broadcast, compute acceleration, medical imaging, and defense systems who need a scalable FPGA with the Arria 10 family’s architecture and IP capabilities. Its on‑chip resources and package density support compact, high‑function designs and long‑term deployment in demanding environments.
Request a quote or submit an inquiry to receive pricing and availability information for 10AX022E4F29I3SG and to discuss how this Arria 10 GX FPGA can meet your design requirements.

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