10AX022E4F27I3SG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 13752320 220000 672-BBGA, FCBGA

Quantity 68 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA, FC (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80330Number of Logic Elements/Cells220000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits13752320

Overview of 10AX022E4F27I3SG – Arria 10 GX FPGA, 672‑BBGA

The 10AX022E4F27I3SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 672‑ball FCBGA package designed for mid‑range, performance‑sensitive applications. As part of the Arria 10 device family, it targets markets that require a balance of high logic density, embedded memory, and power efficiency.

Typical use cases include wireless and wireline communications, broadcast and media processing, computing and storage acceleration, and industrial or defense applications where temperature range and supply characteristics are important. The device combines a large logic element count with on‑chip RAM and high I/O density for complex system integration.

Key Features

  • Logic Capacity  220,000 logic elements to implement complex digital functions and custom hardware acceleration.
  • Embedded Memory  13,752,320 total RAM bits for on‑chip data buffering, lookup tables, and packet or frame storage.
  • I/O and Package  240 user I/O pins in a 672‑BBGA (672‑FBGA, FC 27×27) surface‑mount package, enabling dense board connectivity.
  • Supply and Thermal  Operating supply range 870 mV to 980 mV and industrial operating temperature range of −40 °C to 100 °C for demanding environments.
  • Power‑Efficient Architecture  Part of the Arria 10 family engineered for improved power efficiency and higher performance relative to prior mid‑range devices.
  • High‑Speed Interfaces and IP  Family documentation highlights support for PCIe Gen1/Gen2/Gen3 hard IP, fractional synthesis and I/O PLLs, and low‑power serial transceivers for high‑bandwidth links.
  • DSP and Clocking  The Arria 10 family includes variable‑precision DSP blocks and robust clock networks with multiple PLL clock sources suitable for signal processing and timing‑sensitive applications.
  • Reconfiguration and Reliability  Family features include support for dynamic and partial reconfiguration and SEU error detection and correction mechanisms as described in the device overview.
  • Compliance  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment that require high logic density and low‑power operation.
  • Wireline Networking  40G/100G muxponders, transponders and line cards where embedded memory and high‑speed serial interfaces are needed for aggregation and transport functions.
  • Broadcast & Media  Studio switching, professional audio/video processing and videoconferencing systems leveraging on‑chip RAM and DSP capability.
  • Computing & Storage  Flash cache, server acceleration, and cloud compute offload tasks that benefit from programmable logic and high I/O count.
  • Medical & Defense Systems  Diagnostic imaging, radar, and secure communications that require rugged operating temperature range and field‑programmable flexibility.

Unique Advantages

  • High Logic Density: 220,000 logic elements provide the capacity to implement complex algorithms and hardware accelerators on a single device.
  • Substantial On‑Chip Memory: 13.75 million RAM bits reduce external memory dependence and improve system latency for buffering and lookup operations.
  • Robust I/O and Packaging: 240 I/O pins in a compact 672‑BBGA surface‑mount package enable dense board layouts and multiple external interface options.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in temperature‑challenging environments.
  • Power and Performance Balance: Arria 10 family design emphasizes power‑efficient operation while delivering higher performance than previous mid‑range devices.
  • System Integration Support: Family features such as PCIe hard IP, PLLs, low‑power transceivers, and DSP blocks help consolidate functions and reduce BOM complexity.

Why Choose 10AX022E4F27I3SG?

The 10AX022E4F27I3SG Arria 10 GX FPGA pairs a large logic fabric and significant on‑chip RAM with a high I/O count and industrial temperature capability, making it suitable for mid‑range designs that require both performance and reliability. Its package and supply characteristics support dense board integration and deployment in environments with wide temperature and voltage conditions.

As a member of the Intel Arria 10 device family, this part benefits from documented family‑level features and design resources that support high‑speed interfaces, DSP processing, and advanced clocking and reconfiguration capabilities—providing a scalable platform for communications, compute acceleration, and imaging applications.

Request a quote or submit an RFQ to begin evaluating the 10AX022E4F27I3SG for your next design. Our team can provide pricing, availability, and additional technical documentation to help you move from evaluation to production.

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