10AX022E4F29E3LG

IC FPGA 288 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 288 13752320 220000 780-BBGA, FCBGA

Quantity 836 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA, FC (29x29)GradeExtendedOperating Temperature0°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O288Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80330Number of Logic Elements/Cells220000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits13752320

Overview of 10AX022E4F29E3LG – Arria 10 GX FPGA, 220,000 logic elements, 288 I/O

The 10AX022E4F29E3LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 780-ball BGA/FCBGA package. It is part of the Arria 10 family of 20 nm mid-range FPGAs designed for high-performance, power-sensitive applications.

With 220,000 logic elements, 13,752,320 bits of embedded RAM and 288 I/O, this device targets midrange designs across wireless, wireline, broadcast, computing, medical and defense markets where integration, performance and power efficiency are required.

Key Features

  • Core Capacity 220,000 logic elements provide substantial programmable fabric for complex logic and control functions.
  • Embedded Memory 13,752,320 total RAM bits for on-chip storage, buffering and packet/memory handling.
  • I/O & Package 288 user I/O pins in a surface-mount 780‑BBGA / 780‑FBGA (29×29) package for dense board-level integration.
  • Power Supply Core voltage range specified at 870 mV to 980 mV to match low-voltage power-architecture designs.
  • Operating Range & Grade Extended grade device with an operating temperature range of 0°C to 100°C suitable for many commercial and rugged applications.
  • Integration & IP Arria 10 family features listed in the device overview include variable-precision DSP blocks, embedded memory blocks, clock networks with PLLs, high-speed transceivers, and hard IP such as PCIe Gen1/2/3.
  • Mounting Surface mount package simplifies manufacturing with standard PCB assembly processes.
  • Compliance RoHS compliant.

Typical Applications

  • Wireless infrastructure: Channel cards and remote radio head interfaces where programmable logic and transceiver capability enable flexible RF and baseband processing.
  • Wireline networking: Muxponders, transponders and line cards for 40G/100G systems leveraging embedded memory and hard IP for high-throughput packet handling.
  • Broadcast and professional media: Studio switches and video transport equipment using on-chip RAM and DSP resources for real-time media processing.
  • Computing and storage acceleration: Server offload, flash cache and FPGA acceleration tasks that benefit from dense logic, on-chip memory and PCIe hard IP.
  • Medical and defense systems: Diagnostic imaging, radar and secure communications where programmable logic and integrated transceiver/IP support application-specific implementations.

Unique Advantages

  • High logic density: 220,000 logic elements enable implementation of complex algorithms and multiple parallel data paths on a single device, reducing system BOM.
  • Large on-chip memory: 13,752,320 bits of RAM support buffering, lookup tables and packet handling without immediate reliance on external memory.
  • Rich I/O and compact packaging: 288 I/O in a 780‑ball BGA (29×29) provides dense connectivity for high-pin-count system interfaces while minimizing PCB footprint.
  • Low-voltage core: Core supply range of 870 mV–980 mV aligns with modern low-power power rails, enabling efficient power budgeting.
  • IP and clocking resources: Family-level features such as DSP blocks, PLL-based clock networks, transceivers and PCIe hard IP simplify system integration and accelerate development.
  • Extended grade operation: Specified 0°C to 100°C operation supports a broad set of commercial and ruggedized deployments.

Why Choose 10AX022E4F29E3LG?

The 10AX022E4F29E3LG Arria 10 GX FPGA combines substantial logic capacity, significant on-chip RAM and extensive I/O in a compact 780‑ball FCBGA package. As part of the Arria 10 family of 20 nm mid-range devices, it is positioned for designs that require a balance of performance and power efficiency in wireless, wireline, broadcast, computing and specialized applications.

Supported by Arria 10 device documentation and design resources, this device is suitable for developers who need an IP-rich FPGA platform with flexible clocking, DSP and transceiver capabilities to accelerate time-to-market and consolidate system functionality onto a single programmable device.

Request a quote or submit an inquiry for 10AX022E4F29E3LG to check availability and pricing for your next design.

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