10AX027E1F29I1SG

The 10AX027E1F29I1SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 780-FBGA (29×29) FCBGA package. This industrial-grade FPGA integrates a large programmable fabric with substantial on-chip memory and a high I/O count for complex logic and system integration.

With 270,000 logic elements and 17,870,848 total RAM bits, the device targets designs that require significant logic capacity, memory resources and flexible I/O while operating across a wide industrial temperature range.

Key Features

• Logic Capacity  270,000 logic elements (cells) for implementing large-scale programmable logic designs.
• On-Chip Memory  Total of 17,870,848 RAM bits to support memory-intensive functions and buffering within the FPGA fabric.
• I/O Density  360 device I/O pins to accommodate multiple interfaces and peripheral connections.
• Package & Mounting  780-BBGA, FCBGA package (780-FBGA, 29×29) with surface-mount mounting type for board-level integration.
• Power  Supported core voltage supply range from 870 mV to 980 mV for compatibility with system power rails.
• Operating Range  Industrial operating temperature range from −40°C to 100°C for demanding environmental conditions.
• RoHS Compliance  RoHS compliant to meet environmental and regulatory requirements.

Typical Applications

• High-density logic designs  Use the device where a large number of logic elements are required to implement complex custom logic or state machines.
• Memory-intensive FPGA functions  Leverage the 17,870,848 RAM bits for buffering, on-chip data storage and streaming applications.
• I/O-rich systems  Deploy in systems that need extensive peripheral connectivity or multiple interface endpoints enabled by 360 I/O pins.

Unique Advantages

• Large programmable fabric: 270,000 logic elements enable substantial on-chip logic implementation without immediate external components.
• Significant on-chip RAM: 17,870,848 total RAM bits reduce the need for external memory in many buffering and data-path designs.
• High I/O count: 360 I/O pins provide flexibility for multi-channel interfaces and sensor or peripheral connectivity.
• Industrial temperature rating: Rated for −40°C to 100°C operation to meet industrial environmental requirements.
• Compact FCBGA package: 780-FBGA (29×29) package supports dense board-level integration while maintaining device capability.
• RoHS compliant: Meets environmental compliance requirements for lead-free manufacturing.

Why Choose 10AX027E1F29I1SG?

The 10AX027E1F29I1SG Arria 10 GX FPGA combines a high logic element count, substantial on-chip RAM and a large I/O complement in a compact 780-FBGA package, making it suitable for industrial applications that demand programmable logic capacity and robust operation across a wide temperature range. Manufactured by Intel, the device provides a clear hardware foundation for designs requiring integrated memory and flexible interfacing.

Choose this part when your design requires a balance of logic density, embedded RAM and I/O flexibility with industrial-grade operating limits and RoHS compliance.

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