10AX022E3F29E2LG

The 10AX022E3F29E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 780-BBGA FCBGA package. It is part of the Arria 10 family of 20 nm mid-range FPGAs designed for high-performance, power-efficient applications across wireless, wireline, broadcast, computing, storage, medical, and military markets.

This device integrates 220,000 logic elements, 13,752,320 total RAM bits and 288 general-purpose I/O, delivering high logic density and on-chip memory capacity in a surface-mount, 29 × 29 780-FBGA package for compact system designs.

Key Features

• Logic Capacity  220,000 logic elements provide the programmable fabric required for complex digital designs and system integration.
• Embedded Memory  13,752,320 total RAM bits for on-chip data storage, buffering and memory-mapped designs.
• General-Purpose I/O  288 I/O pins to support broad interfacing with peripherals, memory devices and board-level signals.
• Arria 10 Architecture  Part of the Intel Arria 10 family, which emphasizes higher performance and power efficiency for mid-range FPGA applications.
• Package & Mounting  780-BBGA (FCBGA), 29 × 29 supplier device package with surface-mount mounting type for high-density board layouts.
• Power & Voltage  Specified core voltage supply range of 870 mV to 930 mV to match system power rails and regulator designs.
• Operating Range & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for use in a wide range of environments.
• Compliance  RoHS-compliant construction for regulatory and environmental considerations.

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul where programmable logic and on-chip memory handle signal processing and control functions.
• Wireline Networking  40G/100G muxponders, transponders and line cards requiring high logic density and flexible I/O for packet processing and protocol handling.
• Broadcast & Professional AV  Studio switches, transport and videoconferencing hardware that benefit from the device’s programmable connectivity and embedded memory.
• Computing & Storage  Server acceleration and flash cache interfaces that leverage on-chip logic and RAM for low-latency data paths and custom acceleration functions.

Unique Advantages

• High logic density: 220,000 logic elements enable integration of complex functions and consolidation of discrete components.
• Large on-chip RAM: 13,752,320 bits of embedded memory reduce external memory dependence and shorten data paths.
• Broad I/O count: 288 I/O pins provide design flexibility for interfacing with multiple peripherals and memory standards.
• Compact, high-density package: 780-FBGA (29 × 29) surface-mount package supports space-constrained boards while maintaining thermal and routing practicality.
• Power-focused architecture: Part of the Arria 10 family, which emphasizes performance with power-efficiency features for mid-range FPGA applications.
• Extended temperature support: 0 °C to 100 °C operating range for deployments in a wide set of commercial and embedded environments.

Why Choose 10AX022E3F29E2LG?

The 10AX022E3F29E2LG positions itself as a high-capacity, mid-range Arria 10 GX FPGA that balances logic density, embedded memory and I/O capability in a compact 780-BBGA package. Its specification set—220,000 logic elements, over 13.7 Mb of on-chip RAM, 288 I/O and an extended operating range—makes it suitable for demanding signal processing, networking, video and compute-acceleration tasks where integration and power-conscious operation matter.

Designed within the Intel Arria 10 device family, this FPGA benefits from documented device-level features and development support, offering a scalable option for engineers seeking to consolidate functionality, reduce BOM complexity and build robust, long-lived systems.

Request a quote or submit an inquiry to receive pricing and availability information for the 10AX022E3F29E2LG.