10AX022C3U19I2SG

The 10AX022C3U19I2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 484-ball BFBGA package designed for mid-range, performance-sensitive applications. As a member of the Arria 10 device family, it delivers the performance and power-efficiency characteristics described for Arria 10 devices and is targeted at markets such as wireless, wireline, broadcast, computing and storage, medical, and defense.

This device provides a balance of logic capacity, embedded memory, and I/O density for system designs that require substantial programmable logic, on-chip RAM resources, and a compact surface-mount package with industrial temperature capability.

Key Features

• Logic Capacity  220,000 logic elements suitable for mid-range FPGA designs that require significant programmable logic resources.
• On‑Chip Memory  13,752,320 total RAM bits to support buffering, packet processing, or custom memory structures without immediate need for external RAM.
• I/O Density  240 user I/O pins to support multiple interfaces and peripheral connections in a compact form factor.
• Package & Mounting  484-BFBGA (484-UBGA, 19×19) surface-mount package optimized for dense board integration.
• Supply Voltage  Core voltage range specified at 870 mV to 930 mV for operation within defined power rails.
• Operating Temperature Range  Rated for −40 °C to 100 °C operation, suitable for industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• Wireless Infrastructure  Channel and switch card logic for remote radio heads and mobile backhaul implementations that require programmable processing and interface flexibility.
• Wireline Networking  Line cards, muxponders, and transponder functions where on-chip logic and memory support packet processing and aggregation tasks.
• Broadcast and Media  Studio switching, transport, and video/audio processing that benefit from embedded RAM and programmable logic resources.
• Computing & Storage  Server acceleration and flash-cache interfacing where logic capacity and on-chip memory can be used for custom offload functions.
• Medical and Defense Systems  Imaging, diagnostic scanners, radar, and secure communications where industrial temperature range and programmability are required.

Unique Advantages

• High Logic Density:  220,000 logic elements provide substantial programmable resources for complex digital designs and custom accelerators.
• Significant On‑Chip RAM:  13.75 Mb of embedded RAM bits reduces dependence on external memory for many buffering and processing tasks.
• Ample I/O in a Compact Package:  240 I/Os in a 484‑ball BFBGA (19×19) package supports multi-interface systems while preserving board area.
• Industrial Temperature Rating:  −40 °C to 100 °C operating range supports deployment in industrial and harsh-environment applications.
• Low-Voltage Core Operation:  Core supply specified between 870 mV and 930 mV enables designs constrained by modern low-voltage power rails.
• Regulatory Compliance:  RoHS compliance simplifies environmental and regulatory considerations for product development.

Why Choose 10AX022C3U19I2SG?

10AX022C3U19I2SG positions itself as a mid-range Arria 10 GX FPGA offering a combination of large logic capacity, substantial embedded RAM, and a high I/O count in a high-density BFBGA package. Its industrial temperature rating and defined core voltage range make it suitable for designs that must operate reliably across wider environmental conditions.

As part of the Intel Arria 10 family, the device aligns with a documented ecosystem of device-level features and design resources for mid-range, power-sensitive applications across communications, broadcast, computing, medical, and defense markets—helping teams develop scalable, robust programmable solutions.

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