10AX066H2F34E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 49610752 660000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 34 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 492 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066H2F34E2LG – Arria 10 GX FPGA, 1152‑FCBGA
The 10AX066H2F34E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) offered in a 1152‑ball FCBGA package. It is part of the Arria 10 device family of 20 nm mid‑range FPGAs and SoCs designed for performance‑ and power‑sensitive applications across wireless, wireline, broadcast, computing, medical, and defense markets.
This device delivers a high logic capacity, sizable on‑chip RAM, and broad I/O density in a surface‑mount 1152‑FCBGA (35×35) package, targeting midrange applications that require a balance of integration, performance, and power efficiency.
Key Features
- Logic Capacity 660,000 logic elements (cells) to implement complex digital logic, control and signal processing functions.
- Embedded Memory 49,610,752 total RAM bits for on‑chip data storage, buffering, and embedded memory‑centric designs.
- I/O Density 492 user I/O pins to support wide parallel interfaces and diverse board‑level connectivity.
- Package & Mounting 1152‑BBGA / 1152‑FCBGA package (supplier device package: 1152‑FCBGA, 35×35) in a surface‑mount form factor for compact PCB integration.
- Power Supply Nominal core voltage range of 870 mV to 980 mV, enabling defined power planning for system design.
- Temperature & Grade Extended grade device with an operating temperature range of 0 °C to 100 °C suitable for many commercial and communications environments.
- RoHS Compliant Environmentally compliant material status to meet common regulatory requirements.
- Arria 10 Family Capabilities As an Arria 10 GX device, it benefits from family features described in Intel documentation, including power‑efficient 20 nm architecture, embedded DSP and memory blocks, clocking infrastructure, and high‑speed serial/transceiver capabilities.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment where high logic density and integrated memory support complex baseband processing.
- Wireline Communications Line cards, muxponders and transponders for 40G/100G systems where programmable logic and transceiver integration accelerate protocol and packet processing.
- Broadcast and Pro AV Studio switches, video transport and professional audio/video processing that require flexible logic resources and substantial on‑chip RAM for buffering and format conversion.
- Computing and Storage Server acceleration and flash cache applications benefiting from programmable datapaths, large embedded memory, and high I/O counts for host interfaces.
Unique Advantages
- High Logic Density: 660,000 logic elements enable consolidation of complex functions and system‑level integration on a single device.
- Significant On‑Chip Memory: Nearly 50Mbits of RAM reduces dependence on external memory for buffering and data‑intensive tasks.
- Robust I/O Capability: 492 I/Os provide the flexibility to connect multiple peripherals, high‑speed interfaces, and parallel buses without extensive external multiplexing.
- Compact, Production‑Ready Package: 1152‑FCBGA (35×35) surface‑mount package offers a high pin count in a compact footprint for space‑constrained PCBs.
- Extended Temperature Grade: Rated 0 °C to 100 °C and designated Extended grade to match many commercial and communications deployment requirements.
- Power‑Aware Core Supply: Defined core voltage range (870 mV–980 mV) for precise power budgeting in system design.
Why Choose 10AX066H2F34E2LG?
The 10AX066H2F34E2LG combines Arria 10 family capabilities with a high logic count, large embedded memory, and substantial I/O in a production‑oriented 1152‑FCBGA package. It is positioned for engineers and system designers who need midrange FPGA performance and integration to implement complex signal processing, protocol handling, and data path acceleration while managing board space and power.
This device suits designs where scalability, on‑board integration, and the Arria 10 device family feature set (including DSP resources, embedded memory blocks, and high‑speed serial capabilities as documented for the series) provide long‑term platform flexibility and a clear upgrade path within the family.
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