10AX066H2F34I1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 49610752 660000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,120 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 492 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066H2F34I1SG – Arria 10 GX FPGA, 660,000 logic elements, 49,610,752 RAM bits
The 10AX066H2F34I1SG is an Intel Arria 10 GX family field-programmable gate array (FPGA) supplied in a 1152‑FCBGA (35×35) package. It combines a high logic element count, large embedded RAM capacity and extensive I/O to address mid‑range, performance‑sensitive designs.
Built on the Arria 10 device architecture, the part targets markets including wireless, wireline, broadcast, computing and storage, medical and military applications where performance, integration and industrial temperature operation are required.
Key Features
- Logic Capacity — 660,000 logic elements suitable for complex digital designs and high‑density integration.
- Embedded Memory — 49,610,752 total RAM bits to support large on‑chip buffers, packet processing or algorithm state storage.
- I/O Density — 492 I/O pins to connect multiple external devices, memory interfaces and high‑speed peripherals.
- FPGA Architecture — Arria 10 GX family characteristics from the device overview, including support for adaptive logic modules, variable‑precision DSP blocks and embedded memory blocks.
- High‑Speed Interfaces — Series documentation details hard IP for PCIe (Gen1/Gen2/Gen3) and support for 10 Gbps Ethernet and other high‑speed transceiver features suitable for line‑rate interfaces.
- Power Supply — Core voltage range 870 mV to 980 mV for predictable power planning and supply sequencing.
- Package & Mounting — 1152‑FBGA (35×35) FCBGA package, surface-mount mounting type for PCB integration.
- Industrial Temperature Range — Rated for operation from -40 °C to 100 °C for deployment in industrial environments.
- Compliance — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel and switch cards and mobile backhaul systems using the part’s high logic and DSP capacity for baseband processing and protocol handling.
- Wireline & Networking — 40G/100G muxponders, transponders and line cards that leverage high‑speed transceivers and PCIe hard IP for packet aggregation and transport.
- Broadcast & Professional AV — Studio switching and transport functions that require large on‑chip memory and flexible I/O to manage video and audio streams.
- Compute & Storage Acceleration — Server acceleration, flash cache and cloud compute offload where dense logic and embedded RAM accelerate algorithms and data paths.
- Medical & Industrial Systems — Diagnostic imaging and other industrial-grade applications that benefit from the device’s operating temperature range and integration density.
Unique Advantages
- High Integration Density: 660,000 logic elements and 49,610,752 RAM bits reduce external components and simplify board design.
- Versatile I/O: 492 I/Os provide flexibility to interface with a wide range of peripherals and memory devices without extensive multiplexing.
- Engineered for Mid‑Range Performance: Arria 10 family architecture offers DSP blocks, embedded memory and clocking resources suitable for compute‑intensive functions.
- Industrial‑Grade Operation: -40 °C to 100 °C rating supports deployment in demanding environmental conditions.
- Predictable Power Envelope: Defined core supply range (870 mV–980 mV) aids in power supply design and thermal planning.
- Standards‑Oriented Connectivity: Series-level support for PCIe and 10 Gbps Ethernet simplifies integration into high‑speed data paths.
Why Choose 10AX066H2F34I1SG?
The 10AX066H2F34I1SG positions itself as a high‑capacity Arria 10 GX FPGA option for designs that need significant logic, large embedded RAM and extensive I/O in an industrial temperature package. Its combination of Arria 10 architecture features, high logic element count and robust I/O makes it suitable for mid‑range applications spanning communications, broadcast, compute acceleration and industrial systems.
Choosing this part provides a scalable, integration‑friendly platform backed by the Arria 10 device family documentation and device‑level features for designers who require a balance of performance, memory capacity and interface versatility.
Request a quote or submit an inquiry today to discuss availability and volume pricing for 10AX066H2F34I1SG.

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