10AX066H2F34I2SGES
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 49610752 660000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,078 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 48 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 492 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066H2F34I2SGES – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 660,000 Logic Elements
The 10AX066H2F34I2SGES is an Intel Arria 10 GX field programmable gate array (FPGA) offered in a 1152-FCBGA (35×35) package. It is a 20 nm mid-range FPGA device optimized for high-performance, power-sensitive applications across communications, broadcast, computing, medical and defense markets.
With 660,000 logic elements, substantial on-chip RAM and a broad I/O complement, this Arria 10 GX part delivers a combination of compute density and power efficiency for midrange system designs that require integration, configurable logic and flexible I/O in an industrial-temperature package.
Key Features
- Process and Architecture Arria 10 family device architecture implemented in 20 nm technology designed for mid-range FPGA and SoC applications.
- Logic Capacity 660,000 logic elements to implement complex, highly parallel logic and control functions.
- On‑Chip Memory 49,610,752 total RAM bits of embedded memory for buffering, caches and data-path storage without needing external RAM for many functions.
- I/O and Package 492 device I/O pins in a 1152-FCBGA (35×35) package to support wide, flexible connectivity and board-level routing.
- Power Supply Core supply range specified at 870 mV to 980 mV to support low-voltage operation and power-managed designs.
- Temperature and Mounting Industrial operating temperature range of −40 °C to 100 °C and surface-mount package for standard PCB assembly flows.
- System and IP Features (Arria 10 Family) Device family-level capabilities include embedded memory blocks, variable-precision DSP blocks, PLL clock networks and hard IP for high-speed serial interfaces and PCIe Gen1/2/3, enabling system-level integration.
- Compliance RoHS compliant to meet current environmental regulations for lead-free assemblies.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment using programmable logic for signal processing and timing.
- Wireline Networking 40G/100G muxponders, transponders and line cards where programmable high-density logic and on-chip memory accelerate packet processing and protocol handling.
- Broadcast and Professional AV Studio switches, transport and video processing systems that require deterministic logic, buffering and flexible I/O routing.
- Computing and Storage Flash cache, server acceleration and cloud infrastructure tasks that benefit from custom logic, on-chip memory and DSP capabilities.
- Medical and Defense Systems Diagnostic imaging, radar and electronic warfare subsystems leveraging programmable logic density and industrial temperature operation.
Unique Advantages
- High Logic Density: 660,000 logic elements enable implementation of large, parallel algorithms and complex state machines on a single device, reducing external logic count.
- Large On‑Chip RAM: Nearly 50 million bits of embedded RAM reduce dependency on external memory for many buffering and caching needs, simplifying board design.
- Flexible I/O in a Compact Package: 492 I/O pins in a 1152-FCBGA (35×35) package provide broad connectivity options while maintaining a compact PCB footprint.
- Industrial‑Temperature Operation: −40 °C to 100 °C rating supports deployment in harsher environments and extended temperature ranges.
- Low‑Voltage Core Supply: 870 mV to 980 mV core supply range aligns with power-sensitive system designs seeking lower core power draw.
- Family-Level System IP: Benefits from Arria 10 family features such as embedded DSP blocks, PLLs and hard IP for serial protocols and PCIe, enabling faster integration of complex subsystems.
Why Choose 10AX066H2F34I2SGES?
The 10AX066H2F34I2SGES positions itself as a high-capacity, mid-range FPGA tailored for designs that require significant programmable logic, large on-chip memory and flexible I/O in an industrial-temperature package. Its Arria 10 GX platform brings family-level system features—DSP resources, embedded memory and serial/PCIe hard IP—that help reduce external components and accelerate time to market.
This device is well suited for system designers in communications, broadcast, computing, medical and defense who need a balance of performance, integration and power-conscious operation with the support of the Arria 10 device family.
Request a quote or submit an inquiry to receive pricing, availability and technical assistance for the 10AX066H2F34I2SGES Arria 10 GX FPGA.

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