10AX066H3F34I2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 49610752 660000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 532 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 492 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066H3F34I2SG – Arria 10 GX FPGA, 1152-FCBGA (35×35)
The 10AX066H3F34I2SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) offered in a 1152‑ball FCBGA (35×35 mm) package. It delivers a high logic element count and large on‑chip RAM capacity suitable for midrange, performance‑sensitive embedded and communications applications.
Built on the Arria 10 device family architecture, this industrial‑grade, surface‑mount FPGA offers features found across the series such as adaptive logic modules, variable‑precision DSP capability, embedded memory blocks, and a range of serial/transceiver and hard IP options. The device is targeted at markets requiring a balance of performance and power efficiency.
Key Features
- Core capacity — 660,000 logic elements for implementing complex digital designs and large‑scale logic integration.
- Logic block count — 250,540 logic blocks provide structured resources for mapping logic and fabrics.
- On‑chip memory — 49,610,752 total RAM bits delivered through embedded memory blocks, supporting large buffering and on‑chip data storage.
- I/O and package — 492 device I/Os in a 1152‑BBGA (FCBGA) package, supplier package specified as 1152‑FCBGA (35×35 mm), surface‑mount mounting.
- Power — Core supply range specified at 870 mV to 930 mV, enabling low‑voltage operation consistent with Arria 10 family cores.
- Operating temperature — Industrial grade operation from −40 °C to 100 °C for deployment in temperature‑sensitive environments.
- Series capabilities (Arria 10) — Family features include adaptive logic modules, variable‑precision DSP blocks, embedded memory types, clock networks with PLLs, PCIe Gen1/2/3 hard IP, and low‑power serial transceivers as documented for the Arria 10 device line.
- Reliability and configurability — Series‑level support for dynamic and partial reconfiguration, SEU detection and correction, and power management strategies as described in Arria 10 documentation.
- Environmental compliance — RoHS compliant.
Typical Applications
- Wireless infrastructure — Channel and switch cards, remote radio head interfaces and mobile backhaul designs that benefit from high logic density and embedded memory.
- Wireline and networking — Line cards, muxponders and transponders for 40G/100G systems where PCIe and serial transceiver capabilities from the Arria 10 family are useful.
- Broadcast and professional AV — Studio switches and transport/processing equipment leveraging large on‑chip RAM for frame buffering and low‑latency processing.
- Computing and storage acceleration — Server acceleration, flash cache and cloud compute offloads that require dense logic and DSP resources.
- Medical and industrial systems — Diagnostic imaging, scanners and control systems operating across an industrial temperature range.
Unique Advantages
- High logic density: 660,000 logic elements enable large FPGA designs and consolidation of multiple functions into a single device.
- Substantial on‑chip memory: Nearly 49.6 million bits of RAM for buffering, look‑up tables, and embedded storage reduces external memory dependency.
- Robust I/O and packaging: 492 I/Os in a 1152‑ball FCBGA (35×35 mm) package supports high‑pin‑count designs and dense board integration.
- Industrial temperature rating: −40 °C to 100 °C operation permits deployment in demanding thermal environments.
- Low‑voltage core operation: 870–930 mV supply range supports lower core power profiles consistent with Arria 10 device requirements.
- Series‑level feature set: Access to Arria 10 family capabilities such as variable‑precision DSPs, configurable transceivers, and PCIe hard IP helps address diverse system requirements.
Why Choose 10AX066H3F34I2SG?
The 10AX066H3F34I2SG consolidates high logic capacity, large embedded memory, and a substantial I/O complement into a 1152‑ball FCBGA package rated for industrial use. As part of the Intel Arria 10 family, it offers series‑level features—adaptive logic modules, DSP blocks, configurable transceivers and hard IP—that suit midrange applications needing a balance of performance and power efficiency.
This device is suited for engineers and procurement teams designing communications, compute acceleration, broadcast, and industrial systems who require verified Arria 10 family capabilities with a clearly specified logic, memory, power and thermal profile. Its resource mix supports scalable designs and helps simplify BOMs by integrating large logic and memory capacity on‑chip.
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