10AX066H4F34E3SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 49610752 660000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 564 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 492 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066H4F34E3SG – Arria 10 GX FPGA, 660,000 Logic Elements, 1152-FCBGA
The 10AX066H4F34E3SG is an Intel Arria 10 GX field-programmable gate array (FPGA) implemented in a 1152‑ball FCBGA package. It delivers a high-density, mid-range FPGA architecture optimized for performance and power efficiency in 20‑nm technology.
Designed for applications that require large programmable logic, substantial embedded memory, and extensive I/O, this device targets markets such as wireless, wireline, broadcast, compute and storage, medical imaging, and defense communications.
Key Features
- Logic Capacity Provides 660,000 logic elements to implement complex custom logic and system functions.
- On‑Chip Memory Offers 49,610,752 total RAM bits of embedded memory for packet buffers, frame storage, and algorithm state.
- I/O Density Up to 492 device I/Os to connect with high‑pin‑count memory interfaces, transceivers, and board peripherals.
- Advanced DSP and Logic Blocks Includes variable‑precision DSP blocks and adaptive logic modules suitable for signal processing and arithmetic‑intensive tasks (series feature).
- Clocking and PLL Support Integrates flexible clock networks with PLL sources for timing and frequency synthesis (series feature).
- High‑Speed Serial and Protocol Support Series-level features include low‑power serial transceivers, enhanced PCS hard IP, and hard PCIe support for high‑speed connectivity.
- Power Supply Operates with core voltages in the 870–930 mV range.
- Package & Mounting Available in a 1152‑FCBGA (35×35 mm) supplier device package; package case listed as 1152‑BBGA/FCBGA. Surface mount mounting type.
- Operating Range & Grade Rated for operation from 0°C to 100°C and designated as Extended grade.
- Standards Compliance RoHS compliant.
Typical Applications
- Wireless Infrastructure Channel and switch cards, remote radio heads, and mobile backhaul equipment leveraging large logic and DSP capacity for PHY and MAC implementations.
- Wireline Networking Line cards, muxponders, and transponders requiring high I/O counts and embedded memory for high‑speed packet processing and buffering.
- Broadcast and Professional AV Studio switches and transport systems that benefit from dense logic and on‑chip RAM for frame processing and routing.
- Compute & Storage Acceleration Server acceleration and flash‑cache applications where programmable logic and DSP resources enable custom offload and caching engines.
- Medical & Defense Systems Imaging and radar systems that utilize high logic density and DSP blocks for real‑time signal processing.
Unique Advantages
- Substantial Logic and Memory in One Device: 660,000 logic elements paired with 49,610,752 RAM bits enable large, integrated designs without immediate partitioning across multiple devices.
- High I/O Count for Complex Interfaces: 492 I/Os simplify board routing for multi‑lane memory, transceiver interfaces, and high‑pin peripherals.
- Flexible Clocking and Connectivity: Series features such as PLLs, serial transceivers, and protocol hard IP reduce external component needs and simplify system timing.
- Compact Surface‑Mount FCBGA Packaging: 1152‑ball FCBGA (35×35 mm) provides a dense package footprint suitable for space‑constrained board designs.
- Designed for Power‑Sensitive Mid‑Range Designs: The Arria 10 family emphasizes performance with power efficiency, supporting use cases that need a balance of both.
- Extended Grade Operating Range: 0°C to 100°C rating supports a wide range of commercial and industrial environments where extended temperature performance is required.
Why Choose 10AX066H4F34E3SG?
The 10AX066H4F34E3SG positions itself as a high‑density, power‑aware mid‑range FPGA platform from the Arria 10 family. Its combination of 660,000 logic elements, nearly 50 million bits of on‑chip RAM, and extensive I/O provides a robust foundation for demanding signal processing, networking, and acceleration tasks while keeping component count and board complexity under control.
This device is suited to engineering teams building scalable, high‑performance systems in wireless, wireline, broadcast, compute/storage, medical, and defense markets who need a programmable device with strong integration, series‑level connectivity features, and extended‑grade operating range.
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