10AX066H4F34I3SG

The 10AX066H4F34I3SG is an Intel Arria 10 GX field‑programmable gate array (FPGA) device in a 1152‑ball FCBGA package. It is a 20‑nm mid‑range FPGA optimized for power‑sensitive, high‑performance midrange applications across a range of markets.

With 660,000 logic elements, 49,610,752 bits of embedded RAM and 492 I/O pins, this industrial‑grade, surface‑mount FPGA targets designs that require substantial logic density, on‑chip memory and flexible I/O in a compact package. The device supports operation from 870 mV to 930 mV and a temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  660,000 logic elements for complex programmable logic and system integration.
• Embedded Memory  49,610,752 total RAM bits to support large on‑chip data buffering and state storage.
• I/O Density  492 user I/O pins to interface with external peripherals, memory and high‑speed PHYs.
• Package  1152‑ball FCBGA package (1152‑FCBGA, 35×35) designed for surface‑mount PCB assembly.
• Power  Core voltage supply range 870 mV to 930 mV to match board power‑rail designs.
• Operating Range  Industrial temperature rating from −40 °C to 100 °C for deployment in demanding environments.
• Standards & Compliance  RoHS‑compliant manufacturing.
• Family Capabilities  As an Arria 10 device, it is part of a 20‑nm family focused on performance and power efficiency for midrange FPGA applications.

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment where logic density and on‑chip memory support signal processing tasks.
• Wireline & Optical  Line cards, muxponders and transponders that require reconfigurable logic and significant I/O for interfacing with high‑speed links.
• Broadcast & Professional AV  Studio switches, video processing and transport applications that need flexible logic and embedded memory for buffering and format conversion.
• Computing & Storage  Server acceleration and flash cache controller designs that leverage on‑chip RAM and logic to offload compute tasks.
• Medical & Defense Systems  Diagnostic imaging, radar and secure communications where industrial temperature range and device density support robust system designs.

Unique Advantages

• High Logic Capacity: 660,000 logic elements allow complex algorithms and multiple functions to be integrated into a single FPGA.
• Substantial On‑Chip Memory: Nearly 50 million RAM bits reduce external memory dependence and simplify board design for data‑intensive tasks.
• Flexible I/O Count: 492 I/O pins give designers broad connectivity options for peripherals, memory interfaces and high‑speed transceivers.
• Industrial Operating Range: −40 °C to 100 °C supports deployment in temperature‑challenging environments without additional thermal derating.
• Compact FCBGA Packaging: 1152‑ball, 35×35 FCBGA provides a high‑density footprint suitable for space‑constrained system boards.
• Power‑Focused Design: Narrow core voltage range (870–930 mV) supports predictable power budgeting and board power supply planning.

Why Choose 10AX066H4F34I3SG?

The 10AX066H4F34I3SG Arria 10 GX FPGA combines high logic density, large embedded RAM and extensive I/O in a single industrial‑rated FCBGA package. It is positioned for designers who need a midrange FPGA with a balance of performance and power efficiency drawn from the Arria 10 family characteristics.

This device suits system designers building wireless infrastructure, wireline and broadcast equipment, compute/storage accelerators, or industrial and defense systems that require scalable logic resources, significant on‑chip memory and a defined operating and power envelope. Its RoHS compliance and surface‑mount package simplify manufacturing and supply integration.

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