10AX066H3F34I3SGES

The 10AX066H3F34I3SGES is an Intel Arria 10 GX field programmable gate array (FPGA) offered in a 1152‑ball FCBGA (35×35) package for surface‑mount assembly. It is a 20‑nm mid‑range FPGA designed for high‑performance, power‑sensitive applications across wireless, wireline, broadcast, computing, medical and military markets.

With a large logic capacity, substantial embedded RAM, and extensive I/O, this device targets midrange designs that require a balance of processing density and low‑voltage operation within an industrial temperature window.

Key Features

• Core Logic — 660,000 logic elements provide significant programmable fabric for complex digital designs; 250,540 adaptive logic modules are indicated for fine‑grained logic implementation.
• Embedded Memory — 49,610,752 total RAM bits for on‑chip storage of buffers, FIFOs and intermediate data structures.
• I/O Capacity — 492 I/O pins to support multiple parallel interfaces and peripheral connections.
• Power Supply — Core voltage range specified at 870 mV to 930 mV to match low‑voltage system architectures.
• Package & Mounting — 1152‑BBGA FCBGA package (1152‑FCBGA, 35×35) for surface‑mount PCB assembly, enabling dense integration.
• Operating Range — Industrial temperature rating from −40°C to 100°C to meet demanding environmental conditions.
• Standards & Compliance — RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems that benefit from programmable logic and embedded memory.
• Wireline networking — 40G/100G muxponders, transponders and line cards where substantial logic and I/O support high‑speed packet processing and aggregation.
• Broadcast and media — Studio switches, video transport and conferencing equipment leveraging on‑chip RAM and extensive I/O for signal routing and buffering.
• Computing and storage — Flash cache, server acceleration and cloud computing server designs that require midrange FPGA acceleration and integration.
• Medical and defense systems — Diagnostic imaging, radar and electronic warfare applications that use programmable logic within an industrial temperature range.

Unique Advantages

• High logic density: 660,000 logic elements enable complex algorithms and parallel processing implementations on a single device.
• Large on‑chip memory: Nearly 50 million RAM bits reduce dependence on external memory for many buffering and data‑path needs.
• Extensive external connectivity: 492 I/O pins provide flexibility to interface with multiple buses, sensors and high‑speed transceivers.
• Low‑voltage core operation: 870–930 mV supply range supports integration into modern low‑power system architectures.
• Industrial thermal margin: Specified operation from −40°C to 100°C addresses designs intended for harsh or variable environments.
• Surface‑mount FCBGA packaging: 1152‑ball FCBGA (35×35) supports compact PCB layouts and high‑density system designs.

Why Choose 10AX066H3F34I3SGES?

The 10AX066H3F34I3SGES Arria 10 GX FPGA combines substantial logic capacity, large embedded RAM and a broad I/O complement in a low‑voltage, industrial‑rated package. It is positioned for midrange designs that need a balance of performance and power efficiency while supporting a wide set of application domains from networking to medical imaging.

Designers and procurement teams seeking a 20‑nm Arria 10 device can leverage the device’s documented features and Intel’s device resources to support development, configuration and deployment across varied system architectures.

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