10AX066H4F34E3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 49610752 660000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,441 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 492 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066H4F34E3LG – Arria 10 GX FPGA, 660,000 logic elements, 49,610,752 RAM bits, 492 I/Os
The 10AX066H4F34E3LG is an Intel Arria 10 GX field-programmable gate array (FPGA) supplied in a 1152-FCBGA (35×35) package. It is a 20 nm mid-range FPGA family member designed for high-performance, power-efficient designs across communications, broadcast, compute, and imaging markets.
This device combines high logic density, large embedded memory, and a broad I/O complement to address applications that require significant programmable logic and on-chip RAM while operating within an extended temperature range and a low core-voltage domain.
Key Features
- Logic Capacity — 660,000 logic elements to implement complex custom logic, state machines, and datapath functions.
- Adaptive Logic Module — Architecture built around adaptive logic modules for flexible implementation of combinational and sequential logic (series-level architecture detail).
- Embedded Memory — 49,610,752 total RAM bits of on-chip memory, enabling large buffers, caches, and lookup tables without external memory for many use cases.
- I/O Resources — 492 I/Os to support dense external interfacing and multi-protocol board-level designs.
- Power Domain — Core voltage supply range of 870 mV to 930 mV to match low-voltage power rails and power-management schemes.
- Package & Mounting — Supplied in a 1152-BBGA / 1152-FCBGA (35×35) surface-mount package for board-level integration.
- Operating Range — Extended grade operation from 0 °C to 100 °C for deployment in thermally demanding environments.
- Compliance — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel and switch cards, remote radio head functions and mobile backhaul implementations benefiting from high logic density and on-chip memory.
- Wireline Networking — Line cards, muxponders, and transponder functions where programmable logic and extensive I/O support high-speed packet processing and protocol bridging.
- Broadcast & Media — Studio switches and professional video/audio processing that leverage embedded memory and reconfigurable logic for format conversion and routing.
- Compute & Storage Acceleration — Server acceleration and flash cache applications that need hardware-customizable datapaths and large on-chip buffers.
- Medical & Imaging — Diagnostic imaging and related systems requiring large memory bandwidth and flexible logic for image processing pipelines.
Unique Advantages
- High Logic Density: 660,000 logic elements allow compact implementation of complex algorithms and multiple concurrent functions on a single device.
- Large On‑Chip Memory: Nearly 50 million RAM bits reduce dependency on external memory, lowering BOM and improving latency for buffer- and cache-heavy designs.
- Extensive I/O Palette: 492 I/Os provide the routing flexibility needed for multi-channel interfaces and dense board-level interconnects.
- Low-Voltage Core: A core supply range of 870 mV–930 mV aligns with modern power-rail strategies to help optimize system power consumption.
- Extended Temperature Grade: Rated for 0 °C to 100 °C operation to meet the environmental needs of many telecom, compute, and industrial-adjacent applications.
- Industry Compliance: RoHS compliance supports environmentally conscious product designs and regulatory alignment.
Why Choose 10AX066H4F34E3LG?
The 10AX066H4F34E3LG positions itself as a high-capacity, power-aware mid-range FPGA suitable for designs that require substantial programmable logic, large embedded memory, and dense I/O in a single 1152-FCBGA package. Its Arria 10 family architecture targets high-performance, power-efficient applications and is appropriate for customers building communication systems, compute acceleration, broadcast equipment, and imaging solutions.
Choosing this device provides scalability and integration for systems that need significant on-chip resources while operating within an extended temperature window and low core-voltage domain. The combination of logic density, memory capacity, and I/O count enables consolidation of functions and potential BOM reduction in complex hardware designs.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the 10AX066H4F34E3LG.

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