10AX066H2F34I1HG

The 10AX066H2F34I1HG is an Intel Arria 10 GX field programmable gate array (FPGA) provided in a 1152‑ball FCBGA package. It combines a high logic capacity and large embedded RAM with a broad I/O count, making it suitable for midrange, performance‑sensitive industrial applications.

Designed as part of the Arria 10 device family, this device targets markets such as wireless and wireline communications, broadcast, computing and storage, medical imaging, and defense systems where performance, integration and power efficiency are important.

Key Features

• Core architecture (20‑nm Arria 10 family) Device belongs to the Intel Arria 10 family noted for midrange, high‑performance, power‑efficient 20‑nm FPGA architecture as described in the device overview.
• Logic capacity 660,000 logic elements to implement complex programmable logic and custom digital functions.
• Embedded memory 49,610,752 total RAM bits of on‑chip memory for buffering, lookup tables, and memory‑centric algorithms.
• I/O density 492 user I/O pins to support wide parallel interfaces and multiple high‑speed lanes.
• Transceiver and interface support (series features) Arria 10 family documentation lists low‑power serial transceivers, PCIe Gen1/2/3 hard IP and support for 10 Gbps Ethernet and Interlaken in applicable device variants.
• DSP and clocking (series features) Variable‑precision DSP blocks and extensive clock network resources including PLLs are part of the Arria 10 device feature set described in the product family overview.
• Power and voltage Core supply range specified at 870 mV to 980 mV, enabling designs that require defined low‑voltage core operation.
• Package and mounting Supplied in a 1152‑FCBGA (35 × 35 mm) package; surface‑mount mounting type suitable for standard PCB assembly processes.
• Industrial operating range Rated for operation from −40 °C to 100 °C, supporting use in industrial temperature environments.
• Regulatory RoHS compliant.

Typical Applications

• Wireless infrastructure Channel and switch cards in remote radio heads and mobile backhaul implementations where programmable logic and embedded memory are needed.
• Wireline communications Line cards, muxponders and transponders for 40G/100G systems and aggregation applications leveraging high logic density and transceiver capabilities.
• Broadcast and professional AV Studio switches and video processing systems that require high I/O count and on‑chip buffering.
• Computing and storage acceleration Flash cache, server acceleration and cloud infrastructure offload functions that use DSP blocks and embedded memory.
• Medical and defense systems Diagnostic imaging, radar and guidance applications benefiting from the device’s logic capacity, memory and industrial temperature rating.

Unique Advantages

• High programmable density: 660,000 logic elements provide abundant fabric for complex algorithms and system integration without external ASIC development.
• Large on‑chip memory: Nearly 50 million bits of embedded RAM reduce external memory needs and simplify board design for buffering and lookup functions.
• Broad I/O capability: 492 I/O pins allow flexible interfacing to parallel buses, high‑speed lanes and numerous peripherals.
• Industrial robustness: −40 °C to 100 °C operating range supports deployment in industrial and demanding environments.
• Compact, assembly‑ready package: 1152‑ball FCBGA (35 × 35 mm) enables dense placement on modern PCBs while supporting surface‑mount manufacturing.
• Family‑level interface and IP support: Arria 10 family features documented for transceivers, PCIe and high‑speed Ethernet facilitate integration of standard interfaces where applicable.

Why Choose 10AX066H2F34I1HG?

The 10AX066H2F34I1HG delivers a balanced combination of logic capacity, on‑chip memory and I/O density in an industrial‑rated Arria 10 GX device. It is positioned for midrange applications that require programmable performance, significant embedded RAM and robust temperature tolerance.

Designers and system integrators can leverage the Arria 10 family feature set documented in the device overview—such as DSP blocks, clocking resources and transceiver/IP options—while relying on a clear set of electrical, thermal and packaging specifications for system planning.

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