10CL080YF484I7G

The 10CL080YF484I7G is a Cyclone® 10 LP FPGA offering a high-density logic fabric and substantial on-chip memory in a compact 484-ball BGA package. This industrial-grade device targets I/O-heavy, compute-oriented board designs that require a balance of logic capacity, embedded RAM, and a wide operating temperature range.

Key technical attributes include 81,264 logic elements, 2,810,880 total RAM bits, 289 device I/O pins, and a 1.2 V core supply. The device is supplied in a surface-mount 484-FBGA (23×23) package and is rated for industrial temperature operation from –40 °C to 100 °C.

Key Features

• Logic Capacity — 81,264 logic elements organized to support complex, parallel logic implementations and custom datapaths.
• Configurable Logic Blocks (CLBs) — 5,079 CLBs provide structured logic resources for mapping control, datapath, and glue logic functions.
• On-chip Memory — 2,810,880 total RAM bits to support buffering, FIFOs, and local data storage for streaming and packet-processing tasks.
• I/O Resources — 289 device I/O pins to accommodate multiple interfaces, sensor arrays, and high-channel-count systems.
• Power Supply — 1.2 V core voltage for the programmable fabric, suitable for the specified Cyclone 10 LP device configuration.
• Package & Mounting — Surface-mount 484-FBGA (23×23) / 484-BGA package for compact, high-density board layouts.
• Industrial Temperature Range — Rated for operation from –40 °C to 100 °C to support industrial deployments.
• Environmental Compliance — RoHS compliant to meet common regulatory and manufacturing requirements.

Typical Applications

• Industrial Control & Automation — Industrial-grade temperature rating and abundant I/O make the device suitable for control systems, real-time I/O aggregation, and deterministic interface tasks.
• Protocol Bridging & Interface Aggregation — High I/O count and large logic capacity enable multi-protocol bridging and board-level interface consolidation.
• Signal Processing & Data Buffering — Substantial on-chip RAM and logic resources support streaming data pipelines, buffering, and mid-tier processing functions.
• System Integration & Glue Logic — Compact 484-FBGA package and surface-mount mounting suit dense board designs requiring tight integration between processors, memory, and peripherals.

Unique Advantages

• High logic density: 81,264 logic elements allow implementation of complex custom accelerators and control logic without external ASICs.
• Significant on-chip RAM: 2,810,880 RAM bits reduce dependence on external memory for many buffering and streaming use cases.
• Extensive I/O availability: 289 device I/O pins support multiple interfaces and high-channel-count hardware designs.
• Industrial-ready thermal range: Rated from –40 °C to 100 °C for deployment in industrial environments.
• Compact board footprint: 484-FBGA (23×23) package provides a high-density package option for space-constrained PCBs.
• Regulatory readiness: RoHS compliance supports standard manufacturing and environmental requirements.

Why Choose 10CL080YF484I7G?

The 10CL080YF484I7G positions itself as a capable mid-to-high density Cyclone® 10 LP FPGA for designers who need a balance of logic capacity, embedded RAM, and a large number of I/O pins in a compact, surface-mount BGA package. Its industrial temperature rating and RoHS compliance make it suitable for robust, production-oriented board designs.

This device is well suited for teams building I/O-rich systems, protocol converters, or embedded processing pipelines that benefit from on-chip memory and a sizable logic fabric. It provides a scalable hardware platform where integration and reliability are priority considerations.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and lead-time information for the 10CL080YF484I7G.