10CL080YF780I7G

The 10CL080YF780I7G is an Intel Cyclone® 10 LP field programmable gate array (FPGA) supplied in a 780‑ball FBGA (29×29) package. It provides a high-density programmable logic fabric with 81,264 logic elements and 2,810,880 bits of on-chip RAM for implementing complex custom logic and data buffering.

With 423 user I/O pins, a 1.2 V core supply, surface‑mount packaging, and an industrial operating temperature range of −40 °C to 100 °C, this device targets designs that require substantial I/O, memory resources, and deployment in temperature‑challenging environments.

Key Features

• Programmable Logic Capacity — 81,264 logic elements to implement complex state machines, datapaths, and custom accelerators.
• Embedded Memory — 2,810,880 total RAM bits for FIFOs, buffers, and on‑chip storage.
• High I/O Count — 423 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting — 780‑BGA package (supplier device package: 780‑FBGA 29×29) with surface‑mount mounting type for compact board integration.
• Core Voltage — 1.2 V core supply as specified for standard core operation.
• Operating Temperature & Grade — Industrial grade device rated for −40 °C to 100 °C operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Industrial temperature rating and high I/O count make the device suitable for sensor/actuator interfacing, control logic, and I/O aggregation in factory and process control systems.
• Interface Bridging and Protocol Conversion — Large logic capacity and abundant I/O allow implementation of multi‑protocol bridges and custom protocol handlers.
• Embedded System Integration — On‑chip RAM and programmable logic enable peripheral aggregation, custom hardware accelerators, and glue logic for embedded platforms.

Unique Advantages

• Substantial Logic Density: 81,264 logic elements provide headroom to consolidate multiple functions into a single FPGA, reducing external components.
• Significant On‑Chip Memory: 2,810,880 RAM bits enable local buffering and dataflow optimization without relying on external memory.
• High Pin‑Count Flexibility: 423 I/Os support broad connectivity options—parallel buses, multi‑lane interfaces, and numerous peripherals.
• Industrial Reliability: Rated for −40 °C to 100 °C, supporting deployment in thermally demanding environments.
• Compact Surface‑Mount Package: 780‑FBGA (29×29) packaging helps save PCB area while providing a high pin density.
• RoHS Compliance: Environmentally compliant for regulated manufacturing processes.

Why Choose 10CL080YF780I7G?

The 10CL080YF780I7G combines high logic density, extensive on‑chip memory, and a large I/O count in a compact 780‑FBGA package, making it a practical choice for designers who need to consolidate multiple hardware functions into a single, industrial‑rated FPGA. Its 1.2 V core and RoHS compliance align with standard power and environmental requirements for professional electronic designs.

This device is well suited for teams developing industrial control, interface bridging, and embedded integration solutions where board space, I/O count, and operating temperature range are key considerations. Its specification set supports scalable designs and long‑term deployment in industrial environments.

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