10CL080YF780C8G

The 10CL080YF780C8G is a commercial‑grade Cyclone® 10 LP field‑programmable gate array (FPGA) from Intel. It provides a high count of programmable logic resources and on‑chip RAM in a compact 780‑ball FBGA package for commercial embedded applications.

Designed for system designers who need substantial logic capacity, plentiful I/O, and a compact surface‑mount package, this device targets commercial applications that require flexible, reprogrammable hardware logic at a defined 1.2 V core supply and a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity — 81,264 logic elements (cells) enabling substantial programmable logic integration for complex functions.
• Logic Block Count — 5,079 CLB/LAB units reported for architectural partitioning and resource planning.
• On‑Chip Memory — 2,810,880 total RAM bits to support data buffering, FIFOs, and embedded memory structures.
• I/O Resources — 423 user I/O pins to support broad interfacing needs and high‑pin count peripherals.
• Power Supply — Core voltage specified at 1.2 V (1.2 V to 1.2 V), consistent with Cyclone® 10 LP standard core supply.
• Package & Mounting — 780‑ball FBGA (29×29) in a 780‑BGA package, surface‑mount for compact board assembly.
• Commercial Grade — Specified for commercial operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Use the FPGA where reprogrammable logic and on‑chip RAM (2,810,880 bits) enable custom control, protocol handling, or signal conditioning in commercial devices.
• High‑I/O Interface Hubs — The 423 I/O pins support designs that require many external connections or mixed‑signal interfaces at the board level.
• Compute and Data Buffering — 81,264 logic elements and substantial embedded RAM enable hardware acceleration and buffering tasks within commercial product lines.

Unique Advantages

• High Logic Density: 81,264 logic elements provide the capacity to implement sizable finite‑state machines, datapaths, and custom processing blocks without offloading to external logic.
• Ample On‑Chip Memory: 2,810,880 bits of RAM reduce dependence on external memory for many buffering and streaming use cases, simplifying BOM and board layout.
• Large I/O Count: 423 I/O pins allow flexible interfacing, enabling consolidation of multiple peripheral connections into a single programmable device.
• Compact BGA Package: The 780‑FBGA (29×29) surface‑mount package delivers high pin density in a small footprint for space‑constrained commercial PCBs.
• Commercial Temperature Range: Rated 0 °C to 85 °C, suitable for standard commercial environments and applications.
• RoHS Compliant: Environmentally compliant material selection supports regulatory and manufacturing requirements.

Why Choose 10CL080YF780C8G?

The 10CL080YF780C8G balances strong logic capacity, generous embedded RAM, and a high I/O count in a compact 780‑FBGA package for commercial designs. Its specification suite — including 81,264 logic elements, 2,810,880 RAM bits, 423 I/Os, and a 1.2 V core supply — makes it a suitable choice for engineers building reprogrammable commercial systems that require substantial on‑chip resources and flexible interfacing.

This device is positioned for development teams and production programs that want to consolidate discrete logic and memory into a single FPGA device while maintaining a compact board footprint and standard commercial operating conditions.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical details for the 10CL080YF780C8G.