10CL080YF780C6G

The 10CL080YF780C6G is an Intel Cyclone® 10 LP field programmable gate array (FPGA) offered in a 780-ball FBGA package. It provides a combination of logic capacity, on-chip RAM, and a high I/O count for commercial-grade embedded designs.

Designed for commercial operating environments, this device integrates 81,264 logic elements, 2,810,880 total RAM bits, and 423 I/O pins while operating from a 1.2 V core supply and a 0 °C to 85 °C temperature range.

Key Features

• FPGA Core  Field Programmable Gate Array architecture in the Cyclone® 10 LP family, delivering programmable logic for custom digital designs.
• Logic Capacity  Approximately 81,264 logic elements to implement complex combinational and sequential logic functions.
• On-Chip Memory  2,810,880 total RAM bits available for buffering, FIFOs, and distributed memory structures.
• High I/O Count  423 I/O pins to support dense connectivity and multiple peripheral interfaces on a single device.
• Power  Core voltage supply specified at 1.2 V, providing a defined power domain for core logic operation.
• Package & Mounting  780-FBGA (29×29) package, surface-mount mounting type for compact board integration.
• Commercial Grade & Temperature  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Commercial embedded systems  Implement custom control, glue-logic, and protocol bridging where 423 I/Os and substantial logic resources are required.
• High-density I/O designs  Consolidate multiple peripheral interfaces onto one FPGA using the device’s large I/O count and programmable logic.
• On-board data buffering and processing  Use the 2,810,880 bits of on-chip RAM for packet buffering, FIFO implementations, or intermediate data storage.

Unique Advantages

• High logic integration: 81,264 logic elements allow substantial functionality to be implemented on a single device, reducing component count.
• Large on-chip RAM: 2,810,880 total RAM bits provide significant local memory for buffering and state storage without external memory.
• Extensive I/O: 423 I/O pins enable multiple interfaces and dense board-level connectivity from a single package.
• Compact BGA footprint: 780-FBGA (29×29) surface-mount package supports space-efficient PCB layouts.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for standard commercial deployments.
• Regulatory compliance: RoHS compliance supports environmentally responsible designs.

Why Choose 10CL080YF780C6G?

The 10CL080YF780C6G positions itself as a solid commercial-grade FPGA option where a balance of logic density, on-chip memory, and I/O capacity is required. Its 81,264 logic elements, nearly 2.8 Mb of RAM, and 423 I/Os provide the building blocks for consolidating multiple functions onto a single device, simplifying board-level design and reducing bill-of-materials complexity.

This device is suited for engineering teams developing commercial embedded systems that need defined power and temperature envelopes, compact BGA packaging, and RoHS-compliant components. The specification set offers clear, verifiable parameters to support design, procurement, and qualification activities.

Request a quote or submit a pricing inquiry to start the procurement process for the 10CL080YF780C6G.