5AGXBA1D4F27I5N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 336 8666112 75000 672-BBGA, FCBGA |
|---|---|
| Quantity | 1,017 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 336 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3537 | Number of Logic Elements/Cells | 75000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 8666112 |
Overview of 5AGXBA1D4F27I5N – Arria V GX FPGA, 75,000 Logic Elements, 672-FBGA
The 5AGXBA1D4F27I5N is an Intel Arria V GX field-programmable gate array (FPGA) in a 672-ball FCBGA package. Designed for industrial-grade embedded systems, it provides a high-density programmable fabric with 75,000 logic elements, abundant on-chip RAM, and a broad I/O count for complex interfacing and system integration.
This device is suited to applications that require deterministic operation across a wide temperature range and precise core supply control, offering measurable system integration through its specified RAM, I/O, power, and package characteristics.
Key Features
- Core Logic 75,000 logic elements provide scalable programmable logic capacity for custom datapaths, control logic, and hardware acceleration.
- On-chip Memory Total RAM capacity of 8,666,112 bits to support buffering, FIFOs, and small on-chip data structures without external memory for many control and signal-processing functions.
- I/O Density 336 user I/O pins to accommodate multi-channel interfaces, parallel buses, and mixed-signal front-end connectivity.
- Power Supply Core voltage supply specified from 1.07 V to 1.13 V for precise power sequencing and predictable core operation.
- Package & Mounting 672-ball FCBGA (672-FBGA, 27×27) package in a surface-mount form factor for dense board layouts and reliable soldered connections.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to support industrial environments and extended-temperature deployments.
- Compliance RoHS-compliant construction to meet regulatory requirements for lead-free assembly.
- Documentation Arria V device documentation includes detailed electrical characteristics, switching characteristics, configuration timing, and I/O timing to support system-level design and verification.
Typical Applications
- Industrial Control Programmable logic for motor control, PLC interfacing, and real-time automation tasks where deterministic behavior and extended temperature support are required.
- Communications Infrastructure Custom packet processing, interface bridging, and protocol adaptation leveraging high I/O count and on-chip memory for buffering and packet handling.
- Test & Measurement Signal conditioning, data aggregation, and custom timing logic where flexible FPGA fabric and precise I/O timing are beneficial.
- Embedded Systems Algorithm acceleration and peripheral consolidation in systems that require moderate logic density and substantial local RAM.
Unique Advantages
- High Logic Capacity: 75,000 logic elements enable substantial custom logic implementations without immediate need for external programmable devices.
- Significant On-Chip RAM: 8,666,112 bits of RAM reduce dependence on external memory for many buffering and LUT-based storage needs, simplifying BOM and board routing.
- Large I/O Count: 336 I/Os support complex multi-channel interfaces and simplify integration of peripherals and sensors directly to the FPGA.
- Industrial Robustness: −40 °C to 100 °C operating range supports harsher environments and extended-temperature deployments common in industrial applications.
- Controlled Core Power: Narrow core supply window (1.07 V–1.13 V) provides predictable core behavior and facilitates power-sequencing design.
- Surface-Mount FCBGA Packaging: 672-ball FCBGA (27×27) enables compact, high-density board designs while maintaining soldered mechanical reliability.
Why Choose 5AGXBA1D4F27I5N?
The 5AGXBA1D4F27I5N brings a balanced combination of programmable logic density, on-chip RAM, and I/O resources in an industrial-grade Arria V GX device. Its specified voltage window and extended operating temperature make it suitable for applications that require stable core performance and reliable operation in demanding environments.
Engineers and procurement teams targeting mid-to-high complexity embedded designs will find this part appropriate for integrating custom logic, buffering, and multi-channel interfaces while leveraging the Arria V family documentation for detailed electrical and timing guidance.
Request a quote or submit an inquiry to receive pricing and availability for the 5AGXBA1D4F27I5N and to obtain the full device datasheet for detailed electrical, configuration, and timing specifications.

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