5AGXBA1D4F27I5N

IC FPGA 336 I/O 672FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 336 8666112 75000 672-BBGA, FCBGA

Quantity 1,017 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3537Number of Logic Elements/Cells75000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits8666112

Overview of 5AGXBA1D4F27I5N – Arria V GX FPGA, 75,000 Logic Elements, 672-FBGA

The 5AGXBA1D4F27I5N is an Intel Arria V GX field-programmable gate array (FPGA) in a 672-ball FCBGA package. Designed for industrial-grade embedded systems, it provides a high-density programmable fabric with 75,000 logic elements, abundant on-chip RAM, and a broad I/O count for complex interfacing and system integration.

This device is suited to applications that require deterministic operation across a wide temperature range and precise core supply control, offering measurable system integration through its specified RAM, I/O, power, and package characteristics.

Key Features

  • Core Logic  75,000 logic elements provide scalable programmable logic capacity for custom datapaths, control logic, and hardware acceleration.
  • On-chip Memory  Total RAM capacity of 8,666,112 bits to support buffering, FIFOs, and small on-chip data structures without external memory for many control and signal-processing functions.
  • I/O Density  336 user I/O pins to accommodate multi-channel interfaces, parallel buses, and mixed-signal front-end connectivity.
  • Power Supply  Core voltage supply specified from 1.07 V to 1.13 V for precise power sequencing and predictable core operation.
  • Package & Mounting  672-ball FCBGA (672-FBGA, 27×27) package in a surface-mount form factor for dense board layouts and reliable soldered connections.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to support industrial environments and extended-temperature deployments.
  • Compliance  RoHS-compliant construction to meet regulatory requirements for lead-free assembly.
  • Documentation  Arria V device documentation includes detailed electrical characteristics, switching characteristics, configuration timing, and I/O timing to support system-level design and verification.

Typical Applications

  • Industrial Control  Programmable logic for motor control, PLC interfacing, and real-time automation tasks where deterministic behavior and extended temperature support are required.
  • Communications Infrastructure  Custom packet processing, interface bridging, and protocol adaptation leveraging high I/O count and on-chip memory for buffering and packet handling.
  • Test & Measurement  Signal conditioning, data aggregation, and custom timing logic where flexible FPGA fabric and precise I/O timing are beneficial.
  • Embedded Systems  Algorithm acceleration and peripheral consolidation in systems that require moderate logic density and substantial local RAM.

Unique Advantages

  • High Logic Capacity: 75,000 logic elements enable substantial custom logic implementations without immediate need for external programmable devices.
  • Significant On-Chip RAM: 8,666,112 bits of RAM reduce dependence on external memory for many buffering and LUT-based storage needs, simplifying BOM and board routing.
  • Large I/O Count: 336 I/Os support complex multi-channel interfaces and simplify integration of peripherals and sensors directly to the FPGA.
  • Industrial Robustness: −40 °C to 100 °C operating range supports harsher environments and extended-temperature deployments common in industrial applications.
  • Controlled Core Power: Narrow core supply window (1.07 V–1.13 V) provides predictable core behavior and facilitates power-sequencing design.
  • Surface-Mount FCBGA Packaging: 672-ball FCBGA (27×27) enables compact, high-density board designs while maintaining soldered mechanical reliability.

Why Choose 5AGXBA1D4F27I5N?

The 5AGXBA1D4F27I5N brings a balanced combination of programmable logic density, on-chip RAM, and I/O resources in an industrial-grade Arria V GX device. Its specified voltage window and extended operating temperature make it suitable for applications that require stable core performance and reliable operation in demanding environments.

Engineers and procurement teams targeting mid-to-high complexity embedded designs will find this part appropriate for integrating custom logic, buffering, and multi-channel interfaces while leveraging the Arria V family documentation for detailed electrical and timing guidance.

Request a quote or submit an inquiry to receive pricing and availability for the 5AGXBA1D4F27I5N and to obtain the full device datasheet for detailed electrical, configuration, and timing specifications.

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