5AGXBA1D4F31C5G

The 5AGXBA1D4F31C5G is an Intel Arria V GX family FPGA in a 896-ball FCBGA package intended for surface-mount use. The device provides a high logic capacity and on-chip memory complement aimed at designs that require substantial programmable logic, memory resources, and large I/O counts.

Key device attributes include 75,000 logic elements, 8,666,112 total RAM bits, and 384 I/O pins, together with a tightly specified core voltage range (1.07 V to 1.13 V) and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 75,000 logic elements to implement complex, high-density digital logic and custom datapaths.
• On‑Chip Memory — 8,666,112 total RAM bits for buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Density — 384 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package and Mounting — 896-BBGA FCBGA package (supplier package 896-FBGA, 31 × 31 mm) optimized for surface-mount assembly in space-constrained boards.
• Power — Core supply voltage specified between 1.07 V and 1.13 V for precise power design and decoupling planning.
• Environmental and Grade — Commercial-grade device with RoHS compliance and an operating range of 0 °C to 85 °C.

Typical Applications

• High-density digital logic — Implement complex state machines, protocol stacks, and custom logic with the device's 75,000 logic elements and large RAM resources.
• Data buffering and packet processing — Use the 8,666,112 bits of on-chip RAM for frame buffering, queues, and intermediate storage in packet-centric designs.
• Multi-I/O peripheral systems — Leverage 384 I/Os to interface with multiple sensors, FPGAs, processors, or wide parallel buses on a single board.
• Compact, board-level FPGA solutions — The 896-ball FCBGA (31 × 31 mm) package supports dense board layouts where surface-mount BGA mounting is required.

Unique Advantages

• Substantial logic resources — 75,000 logic elements enable integration of large custom functions that reduce external components and BOM complexity.
• Significant on-chip RAM — 8,666,112 RAM bits provide local memory capacity that helps lower latency and offload external memory traffic.
• High I/O count — 384 I/Os give flexible connectivity options for parallel interfaces, sensor arrays, and subsystem interconnects.
• Compact BGA packaging — 896-BBGA (896-FBGA, 31×31 mm) supports compact, high-density PCB designs while using standard surface-mount assembly processes.
• Commercial-grade qualification — Specified operating range of 0 °C to 85 °C and RoHS compliance for mainstream commercial product deployments.

Why Choose 5AGXBA1D4F31C5G?

The 5AGXBA1D4F31C5G Arria V GX FPGA combines a large logic fabric, extensive on-chip RAM, and a high I/O count in a compact FCBGA package—making it a practical choice for designers who need to consolidate complex logic, buffer large data streams, and maintain wide external connectivity on space-constrained PCBs. Its tightly specified core voltage range and commercial temperature rating support predictable power and thermal planning for production designs.

Manufactured by Intel and RoHS compliant, this device is positioned for commercial embedded and system-level applications that prioritize integration density and on-chip memory capacity while using standard surface-mount assembly processes.

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