5AGXBA1D4F31I5N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 416 8666112 75000 896-BBGA, FCBGA |
|---|---|
| Quantity | 798 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 416 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3537 | Number of Logic Elements/Cells | 75000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 8666112 |
Overview of 5AGXBA1D4F31I5N – Arria V GX FPGA, 75,000 logic elements, 8,666,112 RAM bits, 416 I/Os
The 5AGXBA1D4F31I5N is an Intel Arria V GX Field Programmable Gate Array (FPGA) supplied in a 896‑FBGA (31×31) package. It delivers a large programmable logic resource set and significant on‑chip RAM capacity in a surface‑mount FCBGA package suitable for industrial applications.
With 75,000 logic elements, 8,666,112 total RAM bits and 416 I/Os, this device addresses designs that require substantial logic density, abundant memory resources and a high I/O count while operating across a wide industrial temperature range and a defined core voltage window.
Key Features
- Logic Capacity — 75,000 logic elements provide a large fabric for implementing complex digital functions and custom logic.
- Logic Array — 3,537 logic blocks (as specified) for structured partitioning of designs and resource allocation.
- On‑Chip Memory — 8,666,112 total RAM bits for embedded buffering, FIFOs, and local storage to support memory‑intensive logic.
- I/O Density — 416 user I/Os to support wide peripheral interfacing and high pin‑count requirements.
- Package & Mounting — 896‑BBGA (FCBGA) / 896‑FBGA (31×31) supplier package; surface‑mount mounting for board‑level integration.
- Power — Core supply specified between 1.07 V and 1.13 V to align with system power rails and margin planning.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial deployment needs.
- Regulatory — RoHS compliant.
Typical Applications
- Complex digital systems — Implement large, custom logic functions and state machines using the 75,000 logic elements.
- Memory‑intensive designs — Use the 8,666,112 RAM bits for buffering, packet queues or local data storage without external memory in some architectures.
- I/O‑dense platforms — Support multi‑channel interfaces, parallel buses or dense peripheral connectivity with 416 I/Os.
- Industrial equipment — Deploy in temperature‑sensitive industrial environments with the −40 °C to 100 °C operating range and industrial grade designation.
Unique Advantages
- Large programmable fabric: 75,000 logic elements enable implementation of substantial custom hardware acceleration and control logic within a single FPGA.
- Significant on‑chip RAM: 8,666,112 RAM bits reduce reliance on external memory for many buffering and storage needs, simplifying BOM and board layout.
- High I/O count: 416 I/Os provide flexibility for wide parallel interfaces, multi‑lane connectivity or mixed signal partitioning.
- Industrial readiness: Specified for −40 °C to 100 °C operation, making the device appropriate for demanding environmental conditions.
- Compact, board‑ready package: 896‑FBGA (31×31) FCBGA offers a high‑density, surface‑mount footprint for space‑constrained system designs.
- Tightly specified core voltage: 1.07 V to 1.13 V core supply range supports predictable power budgeting and thermal planning.
Why Choose 5AGXBA1D4F31I5N?
The 5AGXBA1D4F31I5N Arria V GX FPGA combines a high logic element count, multi‑megabit on‑chip RAM and a substantial I/O complement in a single industrial‑grade FCBGA package. Its electrical and thermal specifications provide a clear basis for power, thermal and system integration planning.
This device is a practical choice for engineers building designs that require large on‑chip resources and reliable operation across industrial temperature ranges, while benefiting from the package density and surface‑mount mounting for modern PCB assemblies.
Request a quote or contact our sales team to check availability, lead times and pricing for 5AGXBA1D4F31I5N. Our team can provide ordering information and support for integrating this Arria V GX FPGA into your next design.

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