5AGXBA1D6F27C6G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 336 8666112 75000 672-BBGA, FCBGA |
|---|---|
| Quantity | 82 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 336 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3537 | Number of Logic Elements/Cells | 75000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 8666112 |
Overview of 5AGXBA1D6F27C6G – Arria V GX Field Programmable Gate Array (FPGA) IC 336 8666112 75000 672-BBGA, FCBGA
The 5AGXBA1D6F27C6G is an Arria V GX Field Programmable Gate Array (FPGA) in a 672-ball FCBGA package, designed for applications that require substantial reprogrammable logic, on-chip memory, and a high I/O count. This commercial-grade, surface-mount FPGA provides 75,000 logic elements and 8,666,112 bits of total RAM, enabling complex custom logic implementations and data buffering within a compact footprint.
Operating from a core voltage range of 1.07 V to 1.13 V and rated for 0 °C to 85 °C, the device is RoHS compliant and suited to mainstream embedded and system designs where integration density and predictable power characteristics are important.
Key Features
- Core Logic 75,000 logic elements for implementing large-scale custom logic, state machines, and control functions.
- On-Chip Memory 8,666,112 total RAM bits to support buffering, look-up tables, and memory-intensive logic blocks.
- I/O Capacity 336 I/O pins to accommodate extensive peripheral interfacing and parallel connectivity.
- Package & Mounting 672-BBGA (FCBGA) package in a 672-FBGA (27×27) footprint, designed for surface-mount assembly and compact board layouts.
- Power Core supply operating range from 1.07 V to 1.13 V to support stable power delivery and predictable core behavior.
- Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for general-purpose electronic systems.
- Environmental Compliance RoHS compliant for adherence to common environmental and manufacturing requirements.
Typical Applications
- Reconfigurable Logic & Prototyping Use the 75,000 logic elements and large on-chip RAM to implement and iterate complex custom logic prototypes and programmable datapaths.
- High‑Density I/O Systems The 336 I/O pins enable broad connectivity for boards requiring many interfaces or parallel bus connections.
- Memory-Intensive Processing Leverage 8,666,112 bits of RAM for on-chip buffering, data queuing, and intermediate storage in compute-heavy designs.
Unique Advantages
- Substantial Logic Capacity: 75,000 logic elements provide the headroom to implement complex finite-state machines, datapaths, and custom accelerators on a single device.
- Large On‑Chip Memory: Over 8.6 million RAM bits reduce dependence on external memory for intermediate storage and buffering, simplifying board design.
- High I/O Count: 336 I/Os support extensive peripheral and parallel interfaces without the need for additional GPIO expanders.
- Compact BGA Packaging: 672-FBGA (27×27) package balances integration density and board space efficiency for compact system layouts.
- Predictable Power Window: A narrow core voltage range (1.07 V – 1.13 V) supports consistent power delivery and margin planning in regulated designs.
- RoHS Compliant & Commercial Grade: Meets common environmental manufacturing requirements and is specified for commercial temperature environments (0 °C to 85 °C).
Why Choose 5AGXBA1D6F27C6G?
The 5AGXBA1D6F27C6G Arria V GX FPGA combines a high logic element count, substantial on-chip memory, and a large I/O complement in a compact 672-BBGA FCBGA package. These characteristics make it a strong fit for system designs that require integrated, reprogrammable logic and substantial local memory without expanding PCB real estate.
As a commercial-grade, RoHS-compliant device with a defined core voltage window and standard operating temperature range, this FPGA is positioned for mainstream embedded and electronic systems where integration density, predictable power behavior, and high I/O capability drive component selection.
Request a quote today to discuss availability and pricing for the 5AGXBA1D6F27C6G or to submit a procurement inquiry.

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