5AGXBA3D4F27C4G

The 5AGXBA3D4F27C4G is an Intel Arria V GX Field Programmable Gate Array (FPGA) offered in a commercial grade. It delivers a large programmable fabric with 156,000 logic elements and 11,746,304 total RAM bits, making it suitable for designs that require significant on-chip logic capacity and embedded memory.

Packaged in a 672-ball BGA (FCBGA) with a 672-FBGA (27×27) supplier package footprint and 336 I/O pins, this surface-mount FPGA targets applications that need high I/O density, substantial on-chip RAM, and defined commercial-temperature operation.

Key Features

• Logic Capacity — 156,000 logic elements providing extensive programmable logic resources across the device.
• Logic Block Count — 7,362 logic blocks reported for mapping and resource planning.
• On‑Chip Memory — 11,746,304 total RAM bits for buffering, lookup tables, and data storage within designs.
• I/O Density — 336 I/O pins to support multiple high‑pin-count interfaces and parallel connectivity.
• Package and Mounting — 672‑BBGA (FCBGA) package; supplier device package specified as 672‑FBGA (27×27); surface-mount mounting type.
• Power Range — Core voltage supply range of 1.07 V to 1.13 V to align with system power budgeting.
• Operating Range — Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑density digital systems — Use the large logic element count and on‑chip RAM to implement complex digital processing and custom datapaths.
• Interface aggregation and bridging — 336 I/O pins allow consolidation of multiple peripheral interfaces and parallel buses on a single device.
• Prototyping and platform development — The programmable fabric and substantial memory resources support hardware validation and iterative design development.

Unique Advantages

• Substantial logic and memory in one device: 156,000 logic elements combined with over 11.7 million RAM bits reduces the need for external logic or memory components.
• High I/O count in a compact BGA: 336 I/Os in a 672‑BBGA package deliver dense connectivity while maintaining a manufacturable surface‑mount form factor.
• Predictable power envelope: Narrow core voltage supply range (1.07 V–1.13 V) simplifies power-supply design and sequencing.
• Commercial temperature support: Rated 0 °C to 85 °C for mainstream electronic applications and systems.
• RoHS compliant: Meets common environmental and soldering process requirements for modern electronics manufacturing.

Why Choose 5AGXBA3D4F27C4G?

This Arria V GX FPGA combines a large programmable fabric, significant on‑chip RAM, and a high I/O count in a 672‑ball FCBGA package, offering a compact platform for complex digital designs. Its defined voltage and temperature ranges, along with RoHS compliance, make it suitable for commercial embedded systems that require substantial logic and memory integration.

Engineers and procurement teams will find this device appropriate for designs focused on high logic density, extensive internal memory, and dense I/O routing while leveraging Intel’s Arria V device family documentation for electrical and configuration specifications.

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