5AGXBA3D4F27I5G

IC FPGA 336 I/O 672FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 336 11746304 156000 672-BBGA, FCBGA

Quantity 307 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7362Number of Logic Elements/Cells156000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits11746304

Overview of 5AGXBA3D4F27I5G – Arria V GX Field Programmable Gate Array (FPGA) IC 336 11746304 156000 672-BBGA, FCBGA

The 5AGXBA3D4F27I5G is an Arria V GX Field Programmable Gate Array (FPGA) from Intel offered in an industrial grade. This device provides a high-density, reprogrammable logic platform with 156,000 logic elements and 11,746,304 total RAM bits for complex digital designs.

With up to 336 general-purpose I/Os, a 672‑ball FCBGA package (27 × 27 mm supplier package), and a specified core supply range of 1.07 V to 1.13 V, the device targets applications that require substantial on-chip logic, memory, and connectivity within industrial operating conditions (–40 °C to 100 °C).

Key Features

  • Logic Capacity 156,000 logic elements provide large programmable fabric for implementing complex state machines, custom datapaths, and parallel processing functions.
  • On‑chip Memory 11,746,304 total RAM bits supply substantial embedded memory for buffering, FIFOs, and local data storage.
  • I/O Resources Up to 336 general-purpose I/Os enable broad external interfacing and system connectivity.
  • Package and Mounting 672‑BBGA (FCBGA) package in a 27 × 27 mm supplier package; surface-mount mounting type simplifies board-level integration.
  • Power Core supply specified between 1.07 V and 1.13 V for defined operating conditions and power planning.
  • Industrial Temperature Range Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
  • Standards Compliance RoHS compliant to support environmentally regulated designs.
  • Device Family Documentation Datasheet material covers electrical characteristics, switching characteristics, configuration timing, and I/O timing for Arria V GX devices to support design validation and system integration.

Typical Applications

  • High‑density custom logic Implement large-scale programmable logic and control functions that leverage 156,000 logic elements and extensive on‑chip RAM.
  • Embedded systems and prototyping Use the device where substantial internal memory and I/O count are required for developing and validating complex embedded designs.
  • Industrial control and instrumentation Deploy in systems that require robust operation across –40 °C to 100 °C and benefit from high I/O counts and configurable logic resources.

Unique Advantages

  • High logic and memory integration: 156,000 logic elements combined with 11,746,304 RAM bits reduce the need for external components and simplify board-level architecture.
  • Flexible I/O capacity: 336 I/Os provide extensive connectivity for sensors, peripherals, and external interfaces without complex multiplexing.
  • Industrial readiness: Specified for –40 °C to 100 °C operation to meet the demands of industrial deployments.
  • Compact, surface‑mount package: 672‑BBGA (27 × 27 mm) package balances high pin-count capability with a compact footprint for space-constrained PCBs.
  • Defined core voltage range: 1.07 V to 1.13 V supply specification aids accurate power budgeting and system-level power design.
  • RoHS compliant: Supports environmentally regulated product development and manufacturing workflows.

Why Choose 5AGXBA3D4F27I5G?

The 5AGXBA3D4F27I5G Arria V GX FPGA delivers a blend of high logic density, substantial embedded RAM, and broad I/O capacity within an industrial-grade specification. Its defined electrical and thermal operating windows make it suitable for designs that require reliable programmable logic in challenging temperature conditions.

This device is well suited to engineers and system designers building complex, tightly integrated digital systems who need predictable supply requirements, a compact high‑pin‑count package, and extensive on‑chip resources to minimize external components and streamline board design.

If you would like a quote or more information about pricing and availability for 5AGXBA3D4F27I5G, request a quote or contact sales to submit your requirements and receive a personalized response.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up