5AGXBA3D4F27I5N

IC FPGA 336 I/O 672FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 336 11746304 156000 672-BBGA, FCBGA

Quantity 539 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7362Number of Logic Elements/Cells156000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11746304

Overview of 5AGXBA3D4F27I5N – Arria V GX Field Programmable Gate Array (FPGA) – 156,000 logic elements

The 5AGXBA3D4F27I5N is an Arria V GX-family FPGA IC designed for applications that require substantial on-chip logic capacity and embedded RAM. This device provides 156,000 logic elements and 11,746,304 total RAM bits in a surface-mount 672-ball FCBGA package, delivering a compact, high-density programmable fabric for system designers.

With 336 I/O pins, an industrial operating temperature range, and a tightly specified core supply window, this FPGA targets industrial and embedded designs that need large logic resources, substantial on-chip memory, and robust environmental tolerance.

Key Features

  • Core Logic  156,000 logic elements provide significant programmable logic capacity for complex digital functions and custom accelerators.
  • On‑chip Memory  11,746,304 total RAM bits enable large user memory space for buffers, FIFOs, and temporary storage without external memory dependence.
  • I/O Density  336 general-purpose I/O pins support extensive peripheral interfacing and multi-channel connectivity in a single device.
  • Power Supply  Core voltage supply specified at 1.07 V to 1.13 V for precise power planning and regulator selection.
  • Package & Mounting  672-ball BGA (FCBGA) package, supplier package 672-FBGA (27×27), optimized for surface-mount assembly and dense board layouts.
  • Industrial Grade & Temperature Range  Rated industrial grade with operating temperature from −40 °C to 100 °C for deployment in demanding environments.
  • RoHS Compliant  Meets RoHS environmental requirements for use in modern manufacturing processes.

Typical Applications

  • Industrial Control  Programmable control logic, custom I/O handling, and embedded protocol bridging where industrial temperature range and high logic density are required.
  • Communications & Networking  Protocol processing, packet buffering, and interface aggregation using extensive I/O and large on‑chip RAM resources.
  • Video and Image Processing  Real‑time processing pipelines and frame buffering leveraging the device's logic capacity and substantial RAM bits.
  • Embedded Acceleration  Hardware acceleration for compute‑intensive tasks that benefit from large programmable fabric and local memory.

Unique Advantages

  • High logic capacity: 156,000 logic elements support complex, large-scale designs without immediate partitioning across multiple devices.
  • Large on‑chip RAM: 11,746,304 RAM bits reduce reliance on external memory, improving latency and simplifying board-level BOM.
  • Extensive I/O: 336 I/O pins enable multi‑channel interfacing and flexible system partitioning in one FPGA.
  • Industrial reliability: Rated for −40 °C to 100 °C operation to meet the environmental demands of industrial deployments.
  • Compact, assembly-friendly package: 672-ball FCBGA (27×27) package supports dense PCB integration while remaining compatible with standard surface-mount assembly processes.
  • Predictable power planning: Narrow core supply window (1.07–1.13 V) simplifies regulator selection and power‑domain design.

Why Choose 5AGXBA3D4F27I5N?

The 5AGXBA3D4F27I5N Arria V GX FPGA combines a high count of logic elements, substantial embedded RAM, and a broad I/O complement in a single industrial‑grade FCBGA package. This combination is well suited to embedded and industrial systems that require on-chip resources to implement complex logic, buffering, and interface aggregation without escalating board complexity.

Engineers specifying this device can expect a compact, high-density programmable solution that supports robust thermal and voltage environments, simplifying system architecture while providing headroom for feature growth and iterative hardware acceleration development.

Request a quote or submit a pricing inquiry for 5AGXBA3D4F27I5N through your preferred procurement channel to obtain availability and lead‑time information.

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