5AGXBA3D4F31C5N

IC FPGA 416 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 416 11746304 156000 896-BBGA, FCBGA

Quantity 1,537 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O416Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7362Number of Logic Elements/Cells156000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11746304

Overview of 5AGXBA3D4F31C5N – Arria V GX FPGA, 156,000 logic elements, 11,746,304 RAM bits, 416 I/Os

The 5AGXBA3D4F31C5N is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel supplied in an 896-BBGA FCBGA package. It provides a high-logic-capacity FPGA fabric together with substantial on-chip RAM and a large number of I/O pins, packaged for surface-mount board integration.

Key attributes visible in the device specification include 156,000 logic elements, 11,746,304 total RAM bits, 416 I/Os, a supply voltage window of 1.07 V to 1.13 V, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic Capacity  156,000 logic elements supporting complex logic and control implementations.
  • Embedded Memory  11,746,304 total RAM bits on-chip for frame buffering, packet storage, and local state retention.
  • I/O Count  416 general-purpose I/Os to support broad interfacing and parallel connectivity requirements.
  • Power Supply  Specified core voltage range of 1.07 V to 1.13 V to match system power design constraints.
  • Package & Mounting  Delivered in an 896-BBGA, FCBGA package (supplier device package: 896-FBGA (31x31)) for surface-mount PCB assembly.
  • Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Regulatory  RoHS compliant.

Unique Advantages

  • High integration density: 156,000 logic elements enable consolidation of complex functions into a single FPGA, reducing the need for multiple discrete devices.
  • Substantial on‑chip RAM: 11,746,304 bits of RAM support large buffering and local memory requirements without immediate external memory dependence.
  • Extensive I/O availability: 416 I/Os provide flexible connectivity options for high-pin-count interfaces and parallel subsystem integration.
  • Compact surface-mount package: 896-BBGA FCBGA (896-FBGA (31x31)) packaging supports board-level density and manufacturability for space-constrained designs.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation for general-purpose embedded and electronic equipment environments.
  • Standards-aligned compliance: RoHS compliance supports regulatory requirements for lead-free assembly and global market acceptance.

Why Choose 5AGXBA3D4F31C5N?

The 5AGXBA3D4F31C5N Arria V GX FPGA is positioned for designs that require a combination of high logic density, substantial embedded RAM, and a large I/O complement within a surface-mount BBGA footprint. Its specified core voltage range and commercial operating temperature make it suitable for mainstream embedded and communications applications that align with the provided electrical and environmental specifications.

As an Intel Arria V device, it ships in a 896-BBGA FCBGA package and comes with detailed datasheet documentation to support system integration and validation. Select this part when your design requirements map to the listed logic, memory, I/O, power, and packaging specifications.

Request a quote or submit a pricing and availability inquiry for 5AGXBA3D4F31C5N to receive current lead-time and procurement information.

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