5AGXBA3D4F31I5N

IC FPGA 416 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 416 11746304 156000 896-BBGA, FCBGA

Quantity 400 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BBGA, FCBGANumber of I/O416Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7362Number of Logic Elements/Cells156000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11746304

Overview of 5AGXBA3D4F31I5N – Arria V GX FPGA IC, 896-FBGA (31×31)

The 5AGXBA3D4F31I5N is an Arria V GX Field Programmable Gate Array (FPGA) IC offering a high-density programmable-logic platform. It provides 156,000 logic elements, 11,746,304 total on-chip RAM bits, and 416 I/Os in an industrial-grade, surface-mount 896-BBGA (FCBGA) package.

Designed for designs that require substantial logic capacity, significant embedded memory, and a large I/O count, this device operates across a core supply range of 1.07 V to 1.13 V and an extended temperature range of −40°C to 100°C, with RoHS compliance for manufacturability and environmental requirements.

Key Features

  • High Logic Density  156,000 logic elements (cells) provide a large fabric for complex, programmable designs.
  • On‑Chip Memory  11,746,304 total RAM bits available for data buffering, packet handling, and user memory structures.
  • Extensive I/O  416 I/O pins to support wide parallel interfaces and multiple peripheral connections.
  • Industrial Grade and Temperature Range  Rated industrial grade with an operating temperature range of −40°C to 100°C for demanding environments.
  • Package and Mounting  896-BBGA (FCBGA), supplier device package 896-FBGA (31×31), surface-mount for high-density PCB integration.
  • Core Voltage  Specified core supply range of 1.07 V to 1.13 V to match regulated power domains.
  • RoHS Compliant  Manufacturing and material compliance for regulatory and production requirements.

Typical Applications

  • High‑density programmable logic designs  Leverage 156,000 logic elements to implement large custom logic functions and state machines directly in silicon.
  • Memory‑intensive architectures  Use the 11,746,304 RAM bits for packet buffers, lookup tables, and intermediate data storage inside the FPGA fabric.
  • I/O‑heavy systems  Take advantage of 416 I/Os for multi-channel interfaces, wide buses, and multi-peripheral connectivity.
  • Industrial embedded systems  Industrial-grade temperature rating (−40°C to 100°C) and surface-mount 896-BBGA package support deployment in constrained environments.

Unique Advantages

  • Large programmable fabric: 156,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing external component count.
  • Significant on‑chip RAM: 11,746,304 total RAM bits provide substantial local memory capacity, reducing reliance on external memory for many designs.
  • High pin count: 416 I/Os support dense system connectivity and flexible interfacing without extensive board-level routing changes.
  • Industrial operating range: −40°C to 100°C qualification supports designs intended for extended-temperature deployments.
  • Compact, serviceable package: 896-FBGA (31×31) surface-mount package balances high I/O density with PCB assembly compatibility.
  • Regulatory readiness: RoHS compliance simplifies material selection and product lifecycle planning.

Why Choose 5AGXBA3D4F31I5N?

The 5AGXBA3D4F31I5N positions itself as a high-capacity, industrial-grade Arria V GX FPGA suited to designs that demand large programmable logic resources, substantial on‑chip memory, and a high I/O count within a compact FCBGA package. Its specified core voltage range and extended operating temperature help ensure predictable integration into regulated power domains and temperature-stressed installations.

Engineers and procurement teams looking for a single FPGA platform to consolidate functions, reduce board-level components, and deploy in industrial conditions will find the combination of logic density, RAM capacity, and I/O count compelling for medium- to large-scale programmable designs.

Request a quote or submit a sales inquiry to evaluate 5AGXBA3D4F31I5N for your next project and obtain pricing and availability details.

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