5AGXBA3D4F31I5N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 416 11746304 156000 896-BBGA, FCBGA |
|---|---|
| Quantity | 400 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 416 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7362 | Number of Logic Elements/Cells | 156000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 11746304 |
Overview of 5AGXBA3D4F31I5N – Arria V GX FPGA IC, 896-FBGA (31×31)
The 5AGXBA3D4F31I5N is an Arria V GX Field Programmable Gate Array (FPGA) IC offering a high-density programmable-logic platform. It provides 156,000 logic elements, 11,746,304 total on-chip RAM bits, and 416 I/Os in an industrial-grade, surface-mount 896-BBGA (FCBGA) package.
Designed for designs that require substantial logic capacity, significant embedded memory, and a large I/O count, this device operates across a core supply range of 1.07 V to 1.13 V and an extended temperature range of −40°C to 100°C, with RoHS compliance for manufacturability and environmental requirements.
Key Features
- High Logic Density 156,000 logic elements (cells) provide a large fabric for complex, programmable designs.
- On‑Chip Memory 11,746,304 total RAM bits available for data buffering, packet handling, and user memory structures.
- Extensive I/O 416 I/O pins to support wide parallel interfaces and multiple peripheral connections.
- Industrial Grade and Temperature Range Rated industrial grade with an operating temperature range of −40°C to 100°C for demanding environments.
- Package and Mounting 896-BBGA (FCBGA), supplier device package 896-FBGA (31×31), surface-mount for high-density PCB integration.
- Core Voltage Specified core supply range of 1.07 V to 1.13 V to match regulated power domains.
- RoHS Compliant Manufacturing and material compliance for regulatory and production requirements.
Typical Applications
- High‑density programmable logic designs Leverage 156,000 logic elements to implement large custom logic functions and state machines directly in silicon.
- Memory‑intensive architectures Use the 11,746,304 RAM bits for packet buffers, lookup tables, and intermediate data storage inside the FPGA fabric.
- I/O‑heavy systems Take advantage of 416 I/Os for multi-channel interfaces, wide buses, and multi-peripheral connectivity.
- Industrial embedded systems Industrial-grade temperature rating (−40°C to 100°C) and surface-mount 896-BBGA package support deployment in constrained environments.
Unique Advantages
- Large programmable fabric: 156,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing external component count.
- Significant on‑chip RAM: 11,746,304 total RAM bits provide substantial local memory capacity, reducing reliance on external memory for many designs.
- High pin count: 416 I/Os support dense system connectivity and flexible interfacing without extensive board-level routing changes.
- Industrial operating range: −40°C to 100°C qualification supports designs intended for extended-temperature deployments.
- Compact, serviceable package: 896-FBGA (31×31) surface-mount package balances high I/O density with PCB assembly compatibility.
- Regulatory readiness: RoHS compliance simplifies material selection and product lifecycle planning.
Why Choose 5AGXBA3D4F31I5N?
The 5AGXBA3D4F31I5N positions itself as a high-capacity, industrial-grade Arria V GX FPGA suited to designs that demand large programmable logic resources, substantial on‑chip memory, and a high I/O count within a compact FCBGA package. Its specified core voltage range and extended operating temperature help ensure predictable integration into regulated power domains and temperature-stressed installations.
Engineers and procurement teams looking for a single FPGA platform to consolidate functions, reduce board-level components, and deploy in industrial conditions will find the combination of logic density, RAM capacity, and I/O count compelling for medium- to large-scale programmable designs.
Request a quote or submit a sales inquiry to evaluate 5AGXBA3D4F31I5N for your next project and obtain pricing and availability details.

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