5AGXBA3D6F31C6G

IC FPGA 384 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 384 11746304 156000 896-BBGA, FCBGA

Quantity 836 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O384Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7362Number of Logic Elements/Cells156000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits11746304

Overview of 5AGXBA3D6F31C6G – Arria V GX FPGA, 156,000 logic elements, 384 I/O, 896-BBGA (FCBGA)

The 5AGXBA3D6F31C6G is an Intel Arria V GX Field Programmable Gate Array offered in a commercial-grade package. It combines 156,000 logic elements and 11,746,304 bits of on-chip RAM to support dense digital designs that require substantial programmable logic and embedded memory.

Designed for surface-mount assembly in an 896-BBGA (FCBGA) footprint, this device provides a 31 × 31 mm supplier package and a 1.07 V–1.13 V core supply window, suitable for mainstream embedded and system-level applications that operate between 0 °C and 85 °C.

Key Features

  • Logic Capacity 156,000 logic elements to implement complex digital functions and large-scale custom logic blocks.
  • Embedded Memory 11,746,304 total RAM bits for on-chip data buffering, state storage, and memory-intensive algorithms.
  • I/O Count 384 user I/O pins to support broad peripheral and bus interfacing requirements.
  • Package 896-BBGA, FCBGA package (supplier device package: 896-FBGA, 31×31 mm) optimized for high-density board integration.
  • Power Core supply range of 1.07 V to 1.13 V, enabling consistent core operating conditions within specified limits.
  • Thermal & Mounting Surface-mount device rated for commercial temperature operation from 0 °C to 85 °C.
  • Compliance RoHS-compliant construction for regulatory alignment with common environmental requirements.

Typical Applications

  • High-density digital processing Implement large-scale custom logic, protocol handling, or data-path functions using the 156,000 logic elements and substantial embedded RAM.
  • System I/O consolidation Use the 384 I/O pins to aggregate interfaces and offload glue-logic from surrounding components.
  • Embedded subsystem integration Integrate memory-intensive accelerators or buffering close to the core logic leveraging the device's 11.7 Mb of on-chip RAM.

Unique Advantages

  • Substantial programmable logic: 156,000 logic elements provide the capacity needed for complex finite-state machines, datapaths, and control logic without immediate need for external programmable logic expansion.
  • Large on-chip RAM: 11,746,304 bits of RAM reduce reliance on external memory for intermediate storage and low-latency buffering.
  • High I/O density: 384 I/O pins support diverse peripheral connectivity and multi-channel interfacing in a single device.
  • Board-level integration: 896-BBGA (31×31 mm) FCBGA package enables dense PCB layouts while maintaining a surface-mount assembly footprint.
  • Commercial temperature rating: Rated for 0 °C to 85 °C operation to match a wide range of mainstream embedded environments.
  • Regulatory alignment: RoHS compliance simplifies environmental conformity for end products.

Why Choose 5AGXBA3D6F31C6G?

The 5AGXBA3D6F31C6G Arria V GX FPGA targets designs that require a balanced combination of large programmable logic capacity, substantial on-chip RAM, and abundant I/O in a compact FCBGA footprint. Its commercial-grade rating and defined operating supply window make it suitable for mainstream embedded products and system-level modules where deterministic operating conditions and component-level consolidation are priorities.

Choosing this device provides designers with a scalable, memory-rich FPGA fabric in a high-density package, facilitating tighter integration of custom logic and reducing the need for external resources while maintaining standard commercial thermal and power constraints.

Request a quote or submit a procurement inquiry to evaluate 5AGXBA3D6F31C6G for your next design and confirm availability, pricing, and lead times.

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