5AGXBA3D6F31C6G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 384 11746304 156000 896-BBGA, FCBGA |
|---|---|
| Quantity | 836 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 384 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7362 | Number of Logic Elements/Cells | 156000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 11746304 |
Overview of 5AGXBA3D6F31C6G – Arria V GX FPGA, 156,000 logic elements, 384 I/O, 896-BBGA (FCBGA)
The 5AGXBA3D6F31C6G is an Intel Arria V GX Field Programmable Gate Array offered in a commercial-grade package. It combines 156,000 logic elements and 11,746,304 bits of on-chip RAM to support dense digital designs that require substantial programmable logic and embedded memory.
Designed for surface-mount assembly in an 896-BBGA (FCBGA) footprint, this device provides a 31 × 31 mm supplier package and a 1.07 V–1.13 V core supply window, suitable for mainstream embedded and system-level applications that operate between 0 °C and 85 °C.
Key Features
- Logic Capacity 156,000 logic elements to implement complex digital functions and large-scale custom logic blocks.
- Embedded Memory 11,746,304 total RAM bits for on-chip data buffering, state storage, and memory-intensive algorithms.
- I/O Count 384 user I/O pins to support broad peripheral and bus interfacing requirements.
- Package 896-BBGA, FCBGA package (supplier device package: 896-FBGA, 31×31 mm) optimized for high-density board integration.
- Power Core supply range of 1.07 V to 1.13 V, enabling consistent core operating conditions within specified limits.
- Thermal & Mounting Surface-mount device rated for commercial temperature operation from 0 °C to 85 °C.
- Compliance RoHS-compliant construction for regulatory alignment with common environmental requirements.
Typical Applications
- High-density digital processing Implement large-scale custom logic, protocol handling, or data-path functions using the 156,000 logic elements and substantial embedded RAM.
- System I/O consolidation Use the 384 I/O pins to aggregate interfaces and offload glue-logic from surrounding components.
- Embedded subsystem integration Integrate memory-intensive accelerators or buffering close to the core logic leveraging the device's 11.7 Mb of on-chip RAM.
Unique Advantages
- Substantial programmable logic: 156,000 logic elements provide the capacity needed for complex finite-state machines, datapaths, and control logic without immediate need for external programmable logic expansion.
- Large on-chip RAM: 11,746,304 bits of RAM reduce reliance on external memory for intermediate storage and low-latency buffering.
- High I/O density: 384 I/O pins support diverse peripheral connectivity and multi-channel interfacing in a single device.
- Board-level integration: 896-BBGA (31×31 mm) FCBGA package enables dense PCB layouts while maintaining a surface-mount assembly footprint.
- Commercial temperature rating: Rated for 0 °C to 85 °C operation to match a wide range of mainstream embedded environments.
- Regulatory alignment: RoHS compliance simplifies environmental conformity for end products.
Why Choose 5AGXBA3D6F31C6G?
The 5AGXBA3D6F31C6G Arria V GX FPGA targets designs that require a balanced combination of large programmable logic capacity, substantial on-chip RAM, and abundant I/O in a compact FCBGA footprint. Its commercial-grade rating and defined operating supply window make it suitable for mainstream embedded products and system-level modules where deterministic operating conditions and component-level consolidation are priorities.
Choosing this device provides designers with a scalable, memory-rich FPGA fabric in a high-density package, facilitating tighter integration of custom logic and reducing the need for external resources while maintaining standard commercial thermal and power constraints.
Request a quote or submit a procurement inquiry to evaluate 5AGXBA3D6F31C6G for your next design and confirm availability, pricing, and lead times.

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