5AGXBA5D4F27C4G

IC FPGA 336 I/O 672FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 336 13284352 190000 672-BBGA, FCBGA

Quantity 497 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGA, FCBGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8962Number of Logic Elements/Cells190000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits13284352

Overview of 5AGXBA5D4F27C4G – Arria V GX FPGA, 672‑FBGA (27×27)

The 5AGXBA5D4F27C4G is an Intel Arria V GX Field Programmable Gate Array (FPGA) delivered in a 672‑ball BGA package (supplier package: 672‑FBGA, 27×27). The device provides a high logic-capacity FPGA fabric with substantial on-chip RAM and a large I/O count for complex, integrated digital designs.

Key on‑device specifications include 190,000 logic elements, 13,284,352 total RAM bits, and 336 user I/Os, with surface‑mount packaging and commercial operating grade parameters documented in the Arria V device datasheet.

Key Features

  • Logic Capacity — 190,000 logic elements enabling large programmable designs and substantial RTL implementation density.
  • Embedded Memory — 13,284,352 total RAM bits for on‑chip data buffering, state storage, and memory‑intensive logic.
  • I/O Count — 336 user I/Os to support wide peripheral connectivity and parallel interfaces.
  • Package & Mounting — 672‑BBGA, FCBGA package (supplier device package: 672‑FBGA, 27×27) with surface‑mount assembly.
  • Power Supply — Core voltage operating range specified at 1.07 V to 1.13 V for the device.
  • Operating Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Regulatory Compliance — RoHS compliant.
  • Documented Electrical and Configuration Specifications — Covered by the Arria V device datasheet, which includes electrical characteristics, switching and I/O timing, and configuration specifications.

Unique Advantages

  • High on‑chip logic density: 190,000 logic elements support complex FPGA designs and high gate counts without external logic.
  • Large embedded memory: Over 13 million RAM bits reduce reliance on external memory for many buffering and state‑storage tasks.
  • Extensive I/O availability: 336 I/Os enable broad interfacing options for parallel buses, external peripherals, and custom I/O standards.
  • Compact BGA packaging: 672‑ball FBGA (27×27) provides a dense, surface‑mount form factor suitable for space‑constrained PCB layouts.
  • Well-documented device family: Datasheet coverage of electrical, switching, and configuration specifications supports engineering verification and system integration.
  • RoHS compliant: Conforms to lead‑free manufacturing requirements for regulatory and supply‑chain compatibility.

Why Choose 5AGXBA5D4F27C4G?

The 5AGXBA5D4F27C4G Arria V GX FPGA combines substantial logic resources, a large on‑chip memory footprint, and a high I/O count in a 672‑ball FBGA surface‑mount package. These documented attributes make it a suitable option for designs that require significant programmable logic capacity and integrated memory resources within a compact package and commercial temperature range.

Backed by the Arria V device documentation covering electrical characteristics and configuration specifications, this part provides a clear technical baseline for evaluation, integration, and verification in production designs.

Request a quote or submit a procurement inquiry for 5AGXBA5D4F27C4G through your preferred distributor or procurement portal to check availability and lead times.

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