5AGXBA3D6F27C6G

IC FPGA 336 I/O 672FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 336 11746304 156000 672-BBGA, FCBGA

Quantity 18 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGA, FCBGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7362Number of Logic Elements/Cells156000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits11746304

Overview of 5AGXBA3D6F27C6G – Arria V GX Field Programmable Gate Array (FPGA) – 156,000 logic elements, 672-FBGA (27×27)

The 5AGXBA3D6F27C6G is an Intel Arria V GX commercial-grade Field Programmable Gate Array (FPGA) supplied in a 672-ball FCBGA package. It provides a large programmable fabric with defined on-chip memory and I/O capability for commercial embedded and system designs that require configurable logic and memory resources.

Key values of this device stem from its logic capacity, on-chip RAM, and a high-pin-count package that supports dense I/O integration while operating within a 1.07 V to 1.13 V core supply range and a 0 °C to 85 °C operating temperature window.

Key Features

  • Logic Capacity  156,000 logic elements provide significant programmable logic resources for implementing complex digital functions and custom accelerators.
  • Logic Blocks  7,362 logic blocks (device grouping metric) for organizing and mapping logic structures across the fabric.
  • On‑Chip Memory  11,746,304 total RAM bits of embedded memory enable local data buffering, FIFOs, and distributed storage without immediate reliance on external memory.
  • I/O Density  336 device I/O pins accommodate broad peripheral interfacing and high-channel count connectivity in compact board designs.
  • Package and Mounting  672-BBGA FCBGA (supplier package: 672-FBGA, 27×27) in a surface-mount format to support high-density board layouts.
  • Power Range  Core voltage supply specified at 1.07 V to 1.13 V, enabling predictable power budgeting in system designs.
  • Commercial Grade  Rated for commercial operating conditions with an ambient temperature range of 0 °C to 85 °C.

Typical Applications

  • Commercial programmable systems  Use the device to implement custom logic, protocol bridging, and control functions in commercial electronics that operate within specified temperature and voltage ranges.
  • High‑density I/O subsystems  Leverage 336 I/O pins and the 672‑ball FCBGA package to integrate multiple interfaces and peripherals on compact PCBs.
  • On‑chip buffering and control  Use the 11,746,304 bits of embedded RAM for local buffering, packet queues, or temporary data storage within an FPGA-based control path.

Unique Advantages

  • Substantial programmable fabric: 156,000 logic elements provide the headroom to implement large-scale custom logic and partition designs across the device.
  • Integrated RAM capacity: 11.7 Mb of on-chip RAM reduces dependence on external memory for many buffering and state-storage needs, simplifying board-level memory requirements.
  • High I/O count in a compact package: 336 I/O pins in a 672-FBGA (27×27) surface-mount package enable dense connectivity while maintaining a small PCB footprint.
  • Predictable power envelope: Narrow core voltage range (1.07 V–1.13 V) aids in power-supply design and thermal planning for commercial systems.
  • Commercial-grade qualification: Device is specified for 0 °C to 85 °C operation, matching typical commercial deployment environments.

Why Choose 5AGXBA3D6F27C6G?

The 5AGXBA3D6F27C6G Arria V GX FPGA combines a large logic element count, significant on-chip RAM, and a high I/O density package to address commercial designs that require flexible, reprogrammable logic and local memory. Its defined supply and thermal ranges make system-level power and thermal planning straightforward for embedded and board-level implementations.

This device is well suited to designers and teams building commercial electronic products that need scalable programmable logic, on-chip memory resources, and compact high-pin-count packaging alongside vendor-supported Arria V device documentation.

Request a quote or submit an inquiry to get pricing, availability, and additional technical support for integrating the 5AGXBA3D6F27C6G into your design.

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