5AGXBA3D6F27C6N

The 5AGXBA3D6F27C6N is an Intel Arria V GX Field Programmable Gate Array (FPGA) supplied in a 672-BBGA / FCBGA surface-mount package. This commercial-grade device provides 156,000 logic elements, 11,746,304 bits of on-chip RAM and up to 336 user I/O, making it suitable for high-density programmable logic implementations.

Designed for applications that require significant integrated logic, memory and I/O within a compact FBGA footprint, this FPGA balances density and integration while operating across a commercial temperature range of 0–85 °C and a core supply voltage window of 1.07 V to 1.13 V.

Key Features

• Core Logic — 156,000 logic elements provide substantial programmable logic capacity for complex designs.
• On-chip Memory — Total RAM of 11,746,304 bits enables large on-chip data buffering and intermediate storage.
• I/O Density — Up to 336 user I/O pins support broad interfacing and parallel connectivity.
• Power — Core voltage supply specified between 1.07 V and 1.13 V for defined power domain planning.
• Package & Mounting — 672-FBGA (27×27) / 672-BBGA package case in a surface-mount form factor for compact board-level integration.
• Grade & Temperature — Commercial grade operation with a specified operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High-density programmable logic systems — Use the device’s 156,000 logic elements and extensive on-chip RAM to implement complex logic and state machines.
• Prototyping and development platforms — Balance of logic capacity and I/O count supports FPGA-based prototyping where board-level interfacing and internal memory are required.
• Signal processing and buffering — Large on-chip RAM is suitable for intermediate data storage and buffering in processing pipelines.
• I/O-intensive subsystems — Up to 336 I/O pins enable parallel sensor, actuator or peripheral interfacing in embedded designs.

Unique Advantages

• High logic density: 156,000 logic elements allow integration of substantial functionality into a single device, reducing board-level component count.
• Significant on-chip RAM: 11,746,304 bits of RAM support data buffering, local memory for algorithms, and reduced external memory dependencies.
• Broad I/O capability: 336 user I/O pins offer flexible connectivity for parallel interfaces and multi-channel systems.
• Compact surface-mount package: 672-FBGA (27×27) minimizes PCB footprint for space-constrained designs.
• Defined power envelope: Specified core supply range (1.07 V–1.13 V) simplifies power delivery planning and design validation.
• Commercial temperature and RoHS compliance: Suited for commercial applications with environmental and regulatory conformity.

Why Choose 5AGXBA3D6F27C6N?

The 5AGXBA3D6F27C6N combines a large logic fabric, substantial on-chip RAM and a high I/O count in a compact 672-FBGA surface-mount package. Its commercial-grade temperature range and defined core voltage make it a practical choice for OEMs and developers building dense, memory-rich programmable logic solutions.

Backed by Intel’s Arria V device documentation, the part provides verifiable electrical and configuration specifications to support design validation and system integration efforts.

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