5AGXBA3D4F31C5G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 384 11746304 156000 896-BBGA, FCBGA |
|---|---|
| Quantity | 221 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 384 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7362 | Number of Logic Elements/Cells | 156000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 11746304 |
Overview of 5AGXBA3D4F31C5G – Arria V GX FPGA, 156,000 logic elements, 384 I/Os, 896‑FBGA
The 5AGXBA3D4F31C5G is an Intel Arria V GX field‑programmable gate array (FPGA) in a commercial grade package. It delivers 156,000 logic elements and 11,746,304 bits of on‑chip RAM in a 896‑FBGA (31×31) FCBGA package with surface‑mount mounting, offering a compact, high‑density programmable fabric for complex digital designs.
Key electrical parameters include a core supply range of 1.07 V to 1.13 V and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and backed by the Arria V device documentation describing electrical and switching characteristics, configuration, and I/O timing.
Key Features
- Logic Density 156,000 logic elements provide a large programmable fabric suitable for integrating complex logic, state machines, and custom datapaths.
- On‑Chip Memory 11,746,304 total RAM bits available for FIFOs, buffers, and embedded data storage.
- I/O Capacity 384 I/O pins to support wide parallel interfaces and multiple peripheral connections.
- Package & Mounting 896‑BBGA, FCBGA (896‑FBGA, 31×31) package in a surface‑mount form factor for board‑level integration where space and density are priorities.
- Power Core voltage supply specified from 1.07 V to 1.13 V to match system power budgets and supply sequencing requirements.
- Operating Range Commercial grade operation from 0 °C to 85 °C for standard temperature environments.
- Compliance RoHS compliant for regulatory and manufacturing consistency.
Unique Advantages
- High programmable capacity: The combination of 156,000 logic elements and over 11.7 Mbits of on‑chip RAM enables substantial integration of logic and memory without relying solely on external components.
- Ample external interfacing: 384 I/Os support broad connectivity options for parallel buses, peripheral interfaces, and board‑level routing flexibility.
- Compact, production‑ready package: The 896‑FBGA (31×31) FCBGA surface‑mount package provides a dense footprint suited to space‑constrained PCBs while supporting standard assembly processes.
- Predictable power envelope: A clearly defined core supply range (1.07 V–1.13 V) helps simplify power supply design and sequencing verification.
- Documented device characteristics: The Arria V device datasheet provides detailed electrical, switching, and configuration specifications to support design validation and system integration.
- Regulatory readiness: RoHS compliance supports regulatory requirements for modern electronic products.
Why Choose 5AGXBA3D4F31C5G?
The 5AGXBA3D4F31C5G places high logic density and substantial on‑chip memory into a compact 896‑FBGA footprint, making it a practical choice for designs that require significant programmable resources and abundant I/O in a surface‑mount form factor. Its defined core voltage range and commercial operating temperature make it suitable for standard production environments, while the Arria V family documentation provides the electrical and configuration detail needed for robust system integration.
This device is appropriate for engineering teams seeking a high‑capacity FPGA from Intel with clear, published specifications for logic, memory, I/O, power, and operating conditions—facilitating predictable design, validation, and production planning.
Request a quote or submit an inquiry for pricing and availability of 5AGXBA3D4F31C5G to initiate procurement or evaluation.

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