5AGXBA3D4F27C4N

IC FPGA 336 I/O 672FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 336 11746304 156000 672-BBGA, FCBGA

Quantity 294 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGA, FCBGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7362Number of Logic Elements/Cells156000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11746304

Overview of 5AGXBA3D4F27C4N – Arria V GX FPGA, 156,000 Logic Elements, 672-FBGA

The 5AGXBA3D4F27C4N is an Intel Arria V GX Field Programmable Gate Array (FPGA) offered in a commercial grade. It provides 156,000 logic elements, 11,746,304 bits of on-chip RAM and 336 user I/Os in a 672-ball BGA/FCBGA package footprint.

With a nominal core supply window of 1.07 V to 1.13 V and an operating temperature range of 0 °C to 85 °C, this device is suitable for designs that require substantial programmable logic capacity, significant on-chip memory, and high I/O density in a surface-mount 672-FBGA package.

Key Features

  • Core Capacity  156,000 logic elements provide extensive programmable logic resources for complex digital designs.
  • On-Chip Memory  11,746,304 total RAM bits available for buffering, FIFOs, and on-chip data storage.
  • I/O Density  336 I/O pins to support multiple interfaces and high-pin-count designs.
  • Package & Mounting  672-BBGA (FCBGA) package; supplier device package: 672-FBGA (27×27 mm). Surface-mount mounting type simplifies board integration.
  • Power  Core voltage supply specified from 1.07 V to 1.13 V to match platform power delivery requirements.
  • Operating Range  Commercial grade device rated for 0 °C to 85 °C ambient operation.
  • Regulatory  RoHS compliant.

Typical Applications

  • High-density digital processing  Leverage the 156,000 logic elements and abundant on-chip RAM for packet processing, data-path acceleration, and custom logic blocks.
  • Interface aggregation  Use the 336 I/Os for consolidating multiple peripheral and protocol interfaces on a single FPGA platform.
  • Prototyping and system integration  Surface-mount 672-FBGA package and commercial-grade rating make this device suitable for development boards and production systems within its temperature range.

Unique Advantages

  • Substantial programmable logic  156,000 logic elements enable implementation of large custom logic networks without external programmable devices.
  • Large on-chip RAM  Over 11.7 million RAM bits reduce dependence on external memory for many buffering and real-time data tasks.
  • High I/O capacity  336 I/O pins allow flexible routing and support for multiple simultaneous interfaces.
  • Compact, industry-standard package  672-FBGA (27×27 mm) provides a high pin-count solution in a compact surface-mount form factor for dense PCB designs.
  • Commercial-grade suitability  Rated for 0 °C to 85 °C operation for standard commercial applications.
  • RoHS compliant  Meets environmental compliance requirements for lead-free assembly.

Why Choose 5AGXBA3D4F27C4N?

The 5AGXBA3D4F27C4N Arria V GX FPGA balances significant logic capacity, ample on-chip RAM, and a high I/O count in a 672-ball BGA surface-mount package. Its specified core voltage range and commercial operating temperature make it a practical choice for designers seeking a programmable-logic solution with dense I/O and memory resources.

This device is well suited to development and production designs that require sizable programmable logic blocks and embedded RAM while maintaining a compact board footprint and RoHS compliance.

Request a quote or submit an inquiry for pricing and availability for 5AGXBA3D4F27C4N today.

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