5AGXBA1D6F31C6N

The 5AGXBA1D6F31C6N is an Intel Arria V GX field‑programmable gate array (FPGA) supplied in an 896‑BBGA FCBGA package. It delivers up to 75,000 logic elements with 8,666,112 total on‑chip RAM bits and 416 user I/O pins for high‑density programmable logic designs.

Designed for commercial‑grade applications, this device targets designs that require substantial logic density, significant embedded memory, and a large I/O complement while operating within a 1.07 V to 1.13 V core supply range and a 0 °C to 85 °C operating temperature window.

Key Features

• Core Logic  Approximately 75,000 logic elements to implement complex digital functions and custom processing pipelines.
• On‑Chip RAM  8,666,112 total RAM bits of embedded memory for buffers, FIFOs, and local data storage without external memory.
• I/O Capacity  416 user I/O pins provide extensive interface options for sensors, peripherals, and board‑level interconnects.
• Package and Mounting  896‑ball BGA (FCBGA) package, supplier device package 896‑FBGA (31×31), optimized for surface‑mount assembly.
• Power and Operating Conditions  Core voltage specified between 1.07 V and 1.13 V; commercial operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS‑compliant component suitable for designs requiring lead‑free, environmentally compliant parts.
• Documentation  Detailed Arria V device datasheet available covering electrical characteristics, switching characteristics, configuration specifications, and I/O timing.

Typical Applications

• Custom Logic Acceleration  Implement hardware acceleration and datapath logic using the device’s 75,000 logic elements and extensive on‑chip RAM.
• High‑Density I/O Systems  Drive complex multi‑channel interfaces and board I/O requirements with 416 available I/O pins.
• Embedded Memory‑Centric Designs  Use the large embedded RAM array for packet buffering, frame storage, or algorithm state memory without external DRAM.

Unique Advantages

• High Logic Density: 75,000 logic elements enable substantial integration of combinational and sequential logic on a single device, reducing component count.
• Large On‑Chip Memory: Over 8.6 million RAM bits provide significant local storage for latency-sensitive data and pipeline buffering.
• Extensive I/O: 416 I/Os support multiple parallel interfaces and flexible board routing for complex system designs.
• Compact BGA Package: The 896‑ball FCBGA (31×31) package offers a dense footprint for space‑constrained boards while supporting surface‑mount assembly.
• Commercial‑Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial applications.
• Tightly Defined Power Envelope: Narrow core voltage range (1.07 V–1.13 V) simplifies power‑rail design and control for consistent device behavior.

Why Choose 5AGXBA1D6F31C6N?

The 5AGXBA1D6F31C6N Arria V GX FPGA combines substantial logic capacity, a large embedded RAM resource, and a high I/O count in a single 896‑BBGA package, making it well suited to commercial designs that demand integrated programmable logic and on‑chip memory. Its defined operating voltage and temperature range, together with RoHS compliance and comprehensive datasheet coverage, help accelerate design validation and deployment.

This device is a practical option for engineering teams building mid‑to‑high complexity FPGA designs that require high logic density, sizable local memory, and broad interfacing capability within a commercial‑grade product envelope.

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