5AGXFB5H6F35C6N

The 5AGXFB5H6F35C6N is an Intel Arria V GX field programmable gate array (FPGA) in a 1152-BBGA FCBGA exposed pad package. It provides a large fabric of approximately 420,000 logic elements, roughly 23.6 Mbits of embedded RAM, and up to 544 user I/Os for high-density, I/O-rich designs.

Designed for commercial-grade applications, this device operates within a 1.07 V to 1.13 V core supply window and an ambient temperature range of 0 °C to 85 °C, delivering a balance of integration, memory capacity, and pin count for complex programmable logic tasks.

Key Features

• High Logic Capacity  Approximately 420,000 logic elements for implementing large-scale digital designs and complex state machines.
• Embedded Memory  Approximately 23.6 Mbits of on-chip RAM to support buffering, packet processing, FIFOs, and other memory-intensive functions.
• Extensive I/O  Up to 544 I/O pins to accommodate wide parallel interfaces, multi-channel connectivity, and dense board-level routing.
• Core Voltage  Operates from 1.07 V to 1.13 V core supply for compatibility with specified power architectures.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature for standard commercial environments.
• Package & Mounting  1152-BBGA (FCBGA exposed pad) package, supplier package 1152-FBGA (35×35), designed for surface-mount PCB assembly.
• RoHS Compliant  Manufactured to meet RoHS environmental compliance requirements.

Typical Applications

• High-density digital processing  Leverage the large logic fabric and embedded RAM to implement complex custom datapaths and computation offloads.
• I/O-intensive systems  Use the 544 I/Os to interface with multiple parallel buses, sensors, or external peripherals requiring wide connectivity.
• Memory-rich FPGA functions  On-chip RAM supports buffering, queuing, and other memory-centric logic required by packet processing and streaming applications.

Unique Advantages

• Large programmable fabric: Approximately 420,000 logic elements enable substantial on-chip logic integration and consolidation of discrete components.
• Significant embedded memory: Roughly 23.6 Mbits of RAM reduces reliance on external memory for many buffering and state storage needs.
• High I/O count: 544 I/Os simplify board-level integration for multi-channel and parallel interfaces, minimizing external multiplexing.
• Commercial temperature support: Rated for 0 °C to 85 °C to meet standard commercial deployment requirements.
• Industry-standard package: 1152-BBGA FCBGA exposed pad in a 35×35 supplier package supports surface-mount assembly and thermal management through the exposed pad.
• Regulatory compliance: RoHS-compliant manufacturing supports environmental requirements for commercial product development.

Why Choose 5AGXFB5H6F35C6N?

The 5AGXFB5H6F35C6N Arria V GX FPGA balances a large logic capacity, substantial on-chip memory, and a high I/O count in a single commercial-grade FCBGA package. It is well suited for designs that require dense programmable logic, extensive interfacing, and embedded RAM without expanding board-level complexity.

Backed by Intel as the manufacturer and supported by detailed device specifications, this part is appropriate for teams building commercially deployed systems that need scalable programmable logic, predictable power requirements, and a standard package footprint.

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