5AGXFB5H4F35I3N

The 5AGXFB5H4F35I3N is an Arria V GX Field Programmable Gate Array (FPGA) in an industrial-grade offering. It provides high digital integration with 420,000 logic elements and extensive I/O, targeted at designs that require dense logic capacity and robust industrial temperature operation.

Architected for complex programmable logic implementations, this device pairs a large on-chip memory footprint with broad I/O and a compact surface-mount package to address high-density, industrial embedded systems and control applications.

Key Features

• Core Logic  420,000 logic elements (logic cells) for large-scale combinational and sequential logic integration.
• Embedded Memory  Approximately 23.6 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive logic functions.
• I/O Density  544 user I/O pins to support multiple parallel interfaces, wide buses, and extensive sensor/actuator connectivity.
• Power Supply  Core supply requirement of 1.12 V to 1.18 V, enabling predictable power design for the FPGA core domain.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for demanding industrial environments.
• Package & Mounting  1152-BBGA (FCBGA exposed pad) package; supplier device package specified as 1152-FBGA (35×35), surface-mount mounting for compact PCB integration.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control & Automation  Large logic capacity and industrial temperature rating support complex control algorithms and I/O-rich automation systems.
• Data Aggregation & Protocol Bridging  High I/O count enables aggregation of multiple sensor streams and protocol conversion in embedded gateways and data concentrators.
• High-Density Embedded Systems  Significant on-chip RAM and logic elements provide the resources for FPGA-based accelerators, custom datapaths, and real-time processing.

Unique Advantages

• High Logic Capacity: 420,000 logic elements allow integration of large digital designs on a single device, reducing board-level complexity.
• Substantial On-Chip Memory: Approximately 23.6 Mbits of embedded RAM minimizes external memory dependence for buffering and state storage.
• Extensive I/O Integration: 544 I/O pins provide flexibility to support multiple parallel interfaces and simplify wiring for multi-sensor or multi-channel systems.
• Industrial Reliability: −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial environments with environmental and regulatory considerations.
• Compact Surface-Mount Package: 1152-BBGA (35×35) FCBGA with exposed pad simplifies thermal management while maintaining a compact PCB footprint.

Why Choose 5AGXFB5H4F35I3N?

The 5AGXFB5H4F35I3N Arria V GX FPGA offers a balanced combination of high logic density, plentiful embedded memory, and a large I/O complement in an industrial-grade package. Its electrical and thermal specifications make it suitable for engineers designing compact, reliable systems that require significant programmable logic and on-chip resources.

This device is well suited for teams building scalable, long-life industrial and embedded products where integration density, thermal considerations, and deterministic supply requirements (1.12 V to 1.18 V core) are key design drivers.

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