5AGXFB5H4F35I3

The 5AGXFB5H4F35I3 is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1152-BBGA exposed pad package. This industrial‑grade device integrates 420,000 logic elements and approximately 23.6 Mbits of on‑chip RAM, making it suitable for complex, highly parallel programmable logic implementations that require substantial on‑chip memory and large I/O counts.

Key electrical and environmental characteristics include a core supply range of 1.12 V to 1.18 V, 544 available I/O, surface‑mount mounting, RoHS compliance, and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  420,000 logic elements for implementing large-scale, custom digital logic and state machines.
• Embedded Memory  Approximately 23.6 Mbits of on‑chip RAM to support buffering, lookup tables, and local data storage.
• I/O Capacity  544 I/O pins to support high pin‑count interfaces and dense peripheral connectivity.
• Power and Supply  Core voltage supply specified between 1.12 V and 1.18 V to meet the device’s operating requirements.
• Package and Mounting  1152‑BBGA (FCBGA exposed pad) supplier package described as 1152‑FBGA (35 × 35); designed for surface‑mount assembly.
• Industrial Temperature Range  Operates from −40 °C to 100 °C for deployment in industrial environments.
• Standards and Compliance  RoHS compliant.
• Detailed Configuration and Timing Documentation  Arria V device documentation includes electrical characteristics, configuration timing, I/O timing, and switching characteristics to support system integration and design validation.

Unique Advantages

• High logic density: 420,000 logic elements enable complex FPGA designs without immediate need for multi‑device partitioning.
• Substantial embedded memory: Approximately 23.6 Mbits of on‑chip RAM reduces external memory dependence for many buffering and data‑path tasks.
• Large I/O complement: 544 I/O pins provide flexibility for high‑channel or multi‑interface systems.
• Industrial operating range: Rated for −40 °C to 100 °C to meet industrial application temperature requirements.
• Compact surface‑mount package: 1152‑FBGA (35 × 35) with exposed pad supports thermal management and dense PCB designs.
• Regulatory readiness: RoHS compliance supports environmentally constrained supply chains.

Why Choose 5AGXFB5H4F35I3?

The 5AGXFB5H4F35I3 Arria V GX FPGA combines a large pool of programmable logic, significant on‑chip memory, and a high I/O count in a single industrial‑grade, surface‑mount package. Its defined core voltage range and documented electrical and timing specifications allow engineering teams to plan power delivery and signal integrity with confidence.

This device is a clear option for designs that require dense logic, substantial embedded RAM, and many external interfaces while operating across industrial temperature ranges. Comprehensive Arria V documentation is available to support detailed configuration, timing, and integration tasks.

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