5AGXFB5H4F35I5N

The 5AGXFB5H4F35I5N is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel. It combines a large programmable fabric with substantial on‑chip memory and a high I/O count for complex digital designs.

With 420,000 logic elements, approximately 23.6 Mbits of embedded memory, and 544 I/O pins in a 1152‑BBGA exposed‑pad package, this device targets designs that demand dense logic capacity, significant embedded RAM, and extensive external connectivity while operating over an industrial temperature range.

Key Features

• Core Capacity  420,000 logic elements provide extensive programmable logic resources for complex functionality and custom architectures.
• Embedded Memory  Approximately 23.6 Mbits of on‑chip RAM to support large buffers, tables, and state storage without external memory for many functions.
• I/O Density  544 user I/O pins enable broad external interfacing and parallel data paths for high‑pin‑count systems.
• Package & Mounting  1152‑BBGA, FCBGA exposed pad package (supplier device package: 1152‑FBGA, 35×35); surface‑mount assembly.
• Core Supply Voltage  Narrow core supply range: 1.07 V to 1.13 V, supporting predictable core power domains and supply planning.
• Industrial Temperature and Grade  Industrial grade device rated for operation from −40 °C to 100 °C, suitable for temperature‑challenging environments.
• Environmental Compliance  RoHS compliant for regulatory and environmental alignment.

Typical Applications

• High‑density programmable logic  Leverage the 420,000 logic elements to implement large custom digital datapaths, state machines, and protocol handlers on a single device.
• I/O‑intensive systems  Use the 544 I/O pins for multi‑lane interfaces, parallel sensor arrays, or high‑pin‑count board designs requiring broad external connectivity.
• Embedded memory‑dependent designs  Rely on approximately 23.6 Mbits of on‑chip RAM for buffering, frame storage, and local data tables to reduce external memory bandwidth needs.
• Industrial control and systems  Industrial temperature rating (−40 °C to 100 °C) and surface‑mount BBGA packaging suit FPGA deployment in robust, temperature‑variable applications.

Unique Advantages

• High logic density: 420,000 logic elements consolidate complex functions into a single device, reducing board count and interconnect complexity.
• Substantial embedded RAM: Approximately 23.6 Mbits of on‑chip memory minimizes dependence on external memory for many buffering and storage tasks.
• Large I/O capability: 544 I/O pins support wide parallel interfaces and multiple peripherals without additional I/O expansion.
• Industrial robustness: Operation from −40 °C to 100 °C enables deployment in environments with wide temperature swings.
• Compact FCBGA package: 1152‑BBGA exposed‑pad footprint provides high pin density in a compact board area for space‑constrained designs.
• Controlled core supply: Narrow 1.07 V–1.13 V supply range simplifies power sequencing and core supply design.

Why Choose 5AGXFB5H4F35I5N?

The 5AGXFB5H4F35I5N Arria V GX FPGA delivers a balanced combination of large programmable fabric, significant embedded memory, and broad I/O in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for ruggedized systems where on‑board integration and reliability are priorities.

Manufactured by Intel, this device is suited for engineers designing high‑capacity digital systems that require substantial local RAM and numerous external connections while maintaining controlled core‑voltage and thermal operating ranges.

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