5AGXFB5H4F35I3G

The 5AGXFB5H4F35I3G is an Arria V GX Field Programmable Gate Array (FPGA) IC delivering high logic capacity and extensive I/O in an industrial-grade package. With a large embedded memory budget and a broad operating temperature range, it addresses dense, I/O‑rich programmable logic designs where integration and reliability are priorities.

Key Features

• FPGA Core: Arria V GX field-programmable architecture providing a high-density programmable logic platform.
• Logic Capacity: 420,000 logic elements to implement complex digital functions and multiple subsystems on a single device.
• Embedded Memory: Approximately 23.6 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• High I/O Count: 544 I/O pins to support wide bus interfaces, parallel sensors, or multiple peripheral connections.
• Power Supply: Specified core voltage range of 1.12 V to 1.18 V for defined power planning and supply design.
• Package & Mounting: 1152‑BBGA (FCBGA) / supplier package 1152‑FBGA, FC (35×35) in a surface-mount format for compact board integration.
• Temperature Grade: Industrial operation from –40 °C to 100 °C for deployment in temperature-demanding environments.
• RoHS Compliant: Meets RoHS requirements for lead‑free assembly and environmental compliance.

Typical Applications

• Industrial Automation: Implement motor control logic, deterministic I/O handling, and custom control algorithms within an industrial temperature window.
• High‑Density Embedded Processing: Consolidate multiple digital functions or custom accelerators using the large logic and memory resources.
• I/O‑Intensive Interfaces: Serve as a bridge or aggregator for systems requiring many parallel or high-count I/O connections.
• System Prototyping and Production: Rapidly develop and deploy complex digital designs where on-chip resources and package density reduce board-level components.

Unique Advantages

• High Logic Integration: 420,000 logic elements enable consolidation of multiple functions that would otherwise require several discrete devices, reducing BOM complexity.
• Substantial On‑Chip Memory: Approximately 23.6 Mbits of embedded RAM lowers dependence on external memory for buffering and data staging.
• Extensive I/O Capability: 544 I/O pins provide flexibility for wide buses, numerous sensors, or multi-channel interfaces without additional multiplexing logic.
• Industrial‑Grade Operation: Rated for –40 °C to 100 °C, supporting deployment in environments with extended temperature requirements.
• Compact Surface‑Mount Packaging: 1152‑BBGA/FBGA package (35×35) supports high-density board layouts while maintaining robust soldered connections.
• Defined Core Power Envelope: Narrow supply range (1.12–1.18 V) simplifies power-supply selection and thermal planning for the core domain.

Why Choose 5AGXFB5H4F35I3G?

This Arria V GX FPGA combines large logic capacity, significant embedded memory, and an expansive I/O count in an industrial-grade, surface-mount package. It is positioned for designs that require high integration, predictable thermal and power planning, and the flexibility of field-programmable logic.

Designers targeting complex digital systems—such as industrial controllers, I/O aggregation platforms, or high‑density embedded applications—will find the 5AGXFB5H4F35I3G offers scalability and resource headroom to consolidate functions and reduce board-level complexity while operating across a wide temperature range.

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